Package Intersil W4x5.20B — Datenblatt

HerstellerIntersil
SerieWLCSP
ArtikelnummerW4x5.20B
Package Intersil W4x5.20B

20 Ball Wafer Level Chip Scale Package (WLCSP)

Package Outline Drawing (POD)

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Parameter

FamilyWLCSP-BP
Pin Count20
Length2.15 mm
Width1.82 mm
Height max0.55 mm
Weight0.0040 g
Pitch0.40 mm
Lead Free Peak Temperature260 °C
Package IndexW4X5.20B

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