Package Intersil W4x4.16G — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
W4x4.16G
16 BALL WLCSP WITH 0.4mm PITCH 4x4 ARRAY (1.740mm x 1.740mm)
Rev 1, 9/16 X 0.400 1.740 В±0.030 Y D
16X 0.265 В±0.035 1.740 В±0.030 C
B (4X) A 0.10 0.270
1
0.200 PIN 1 (A1 CORNER) TOP VIEW 2 3 4
0.270 BOTTOM VIEW Z PACKAGE OUTLINE 0.05 Z SEATING PLANE
3 0.215
0.265
0.400
0.265 В±0.035 4 0.10
0.05 ZXY
Z
5 6 NSMD 0.200 В±0.030 TYPICAL RECOMMENDED LAND PATTERN 0.50 В±0.050
SIDE VIEW NOTES:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASMEY 14.5-1994.
3. Primary datum Z and seating plane are defined by the
spherical crowns of the bump.
4. Dimension is measured at the maximum bump diameter
parallel to primary datum Z. …