Package Intersil W3x4.12B — Datenblatt

HerstellerIntersil
SerieWLCSP
ArtikelnummerW3x4.12B
Package Intersil W3x4.12B

12 BALL WAFER LEVEL CHIP SCALE PAKET (WLCSP 0,4 mm Abstand)

Parameter

FamilyWLCSP-BP
Pin Count12
Length1.69 mm
Width1.29 mm
Thickness0.50 mm
Height max0.55 mm
Pitch0.40 mm
Lead Free Peak Temperature260 °C
Package IndexW3X4.12B

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