Package Intersil W3x3.9F — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
W3x3.9F
9 BALL 3x3 ARRAY THIN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch)пЂ 
Rev 0, 3/16 X
1.410 В±0.030 Y 0.400 C
1.410 В±0.030 9x 0.265 В± 0.035 B 0.305 A
(4X) 0.10
1
TOP VIEW 2 3 PIN 1
(A1 CORNER) 0.305
BOTTOM VIEW Z
0.05 Z SEATING PLANE
3 PACKAGE OUTLINE 0.240 0.265 В±0.035 0.10 M Z X Y
0.05 M Z 0.400
0.290 0.200 В±0.030
0.403 В±0.050
RECOMMENDED LAND PATTERN SIDE VIEW NOTES:
1. All dimensions are in millimeters.
2. Dimensions and tolerance per ASMEY 14.5 -1994, and JESD 95-1 SPP-010.
3. NSMD refers to non-solder mask defined pad design per Intersil Techbrief TB451. 1 …