Package Intersil M8.173 — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
M8.173
8 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 2, 01/10
A
2 4 3.0 В±0.5
SEE DETAIL "X" 5 8 6.40
CL 4.40 В±0.10
3 4 PIN 1
ID MARK
0.20 C BA 1 4
0.09-0.20 B 0.65
TOP VIEW END VIEW 1.00 REF
0.05 H
C 0.90 +0.15/-0.10
1.20 MAX SEATING
PLANE
0.25 +0.05/-0.06
0.10 C 0.10 GAUGE
PLANE 0.25 6 CBA 0В°-8В° 0.05 MIN
0.15 MAX 0.60 В±0.15
DETAIL "X" SIDE VIEW (1.45) NOTES:
1. Dimensions are in millimeters. …