Package Intersil M24.173 — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
M24.173
24 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 1, 5/10
A
1 3 7.80 В±0.10
SEE DETAIL "X" 13 24 6.40
PIN #1
I.D. MARK 4.40 В±0.10
2 3 0.20 C B A 1 12
0.15 +0.05
-0.06 B 0.65
TOP VIEW END VIEW 1.00 REF
H -0.05 C 0.90 +0.15
-0.10
1.20 MAX GAUGE
PLANE SEATING PLANE
0.25 +0.05
-0.06
0.10 M C B A 0.10 C 5 0В°-8В° 0.05 MIN
0.15 MAX SIDE VIEW 0.25 0.60В± 0.15 DETAIL "X" (1.45)
NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs. …