Plastic Packages for Integrated Circuits
Thin Plastic Quad Flatpack Exposed Pad Packages (EPTQFP)
Q80.12x12 E
E1 80 LEAD THIN PLASTIC QUAD FLATPACK EXPOSED PAD
PACKAGE
MILLIMETERS
SYMBOL D1 9.500 REF 80 D 1 PIN 1 TOP VIEW MIN 11.950В±0.100 B Y -1.20 Overall height 0.05 0.10 0.15 Standoff A2 0.90 1.00 1.10 Package thickness D 13.8 14.0 14.2 Lead tip to tip D1 11.9 12.0 12.1 Package length E 13.8 14.0 14.2 Lead tip to tip E1 11.9 12.0 12.1 Package width L 0.45 0.60 0.75 Foot length 1.000 REF. T 0.09 T1 0.097 SIDE VIEW Lead length 0.150 0.20 0.127 0.157 Lead base metal thickness 0В°~7В° Lead thickness Foot angle b 0.17 0.22 0.27 Lead width b1 0.17 0.20 0.23 Lead base metal width e
12В° ALL AROUND REMARKS A a 12.000В±0.100 B MAX A1 L1
12В° ALL AROUND TYP 0.500 BASE Lead pitch ccc -0.080 -Foot coplanarity ddd -0.080 -Foot position
Rev. 0 8/07 NOTES:
EXPOSED
PAD AREA 1. General tolerance. Distance: В±0.1000, Angle: В±2.5В°
2. Matte finish on package body surface except ejection and pin 1
marking: Ra0.8~2.0um
3. All molded body sharp corner radii unless otherwise specified:
MAX. R0.200 REF. 6.000 4. Package/lead frame misalignment (X, Y): MAX. 0.127
5. Top/bottom package misalignment (X, Y): MAX. 0.127
6. Drawing does not include plastic or metal protrusion or cutting
burr.
7. Compliant to JEDEC standard MS-026. PIN 1 REF. 6.000 b
BOTTOM VIEW T
b1
SECTION B-B A1 SEATING …
