Plastic Packages for Integrated Circuits
Thin Plastic Quad Flatpack Packages (TQFP)
Q32.5x5 (JEDEC MS-026AAA ISSUE B)
32 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
MILLIMETERS D
D1
-D-B-A-E E1 e
PIN 1
SEATING
A PLANE -H-0.08
0.003
-C-SYMBOL MIN MAX NOTES A -1.20 -A1 0.05 0.15 -A2 0.95 1.05 -b 0.17 0.27 6 b1 0.17 0.23 -D 6.90 7.10 3 D1 4.90 5.10 4, 5 E 6.90 7.10 3 E1 4.90 5.10 4, 5 L 0.45 0.75 N 32 e 0.50 BSC 7
Rev. 0 2/07 NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane -C-. 0.08
0.003 M C A-B S 11o-13o
0.020
0.008 MIN b 5. Dimensions D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.25mm (0.010 inch) per side. 0.09/0.16
A2 A1 0.004/0.006 GAGE
PLANE 11o-13o 1 6. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width to exceed the maximum b dimension by more than 0.08mm (0.003 inch). …
