Package Intersil L20.4x4A — Datenblatt

Plastic Packages for Integrated Circuits
Thin Quad Flat No-Lead Plastic Package
(TQFN)
Thin Micro Lead FramePlastic Package
(TMLFP) L20.4x4A
20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220WGGD-1 ISSUE I)
MILLIMETERS
SYMBOL MIN NOMINAL MAX NOTES A 0.70 0.75 0.80 -A1 -0.02 0.05 -A2 -0.55 0.80 A3
b 0.18 D 0.25 9
0.30 5, 8 4.00 BSC D1
D2 9 0.20 REF -3.75 BSC
1.95 2.10 9
2.25 7, 8 E 4.00 BSC -E1 3.75 BSC 9 E2 1.95 e 2.10 2.25 7, 8 0.50 BSC -k 0.20 -L 0.35 0.60 0.75 8 N 20 2 Nd 5 3 Ne 5 3 P -0.60 Оё -12 9
9
Rev. 0 11/04 NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be …