Plastic Packages for Integrated Circuits
Small Outline Plastic Packages (SOIC)
M28.3 (JEDEC MS-013-AE ISSUE C) N 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX
AREA H 0.25(0.010) M B M INCHES E SYMBOL
-B-1 2 3 L
SEATING PLANE -A-A D h x 45o a
e A1 B C
0.10(0.004) 0.25(0.010) M C A M B S MAX MILLIMETERS
MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 -A1 0.0040 0.0118 0.10 0.30 -B 0.013 0.0200 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 -D 0.6969 0.7125 17.70 18.10 3 E 0.2914 0.2992 7.40 7.60 4 e -C-MIN 0.05 BSC h 0.01 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 О± 10.00 -0.394 N 0.419 1.27 BSC H 28
0o 10.65 -28
8o 0o 7
8o Rev. 1, 1/13 NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side. TYPICAL RECOMMENDED LAND PATTERN
(1.50mm) 4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area. (9.38mm) 6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions. …
