Plastic Packages for Integrated Circuits
Shrink Small Outline Plastic Packages (SSOP)
Quarter Size Outline Plastic Packages (QSOP)
M28.15 N
INDEX
AREA H 0.25(0.010) M E 2 SYMBOL 3
0.25
0.010 SEATING PLANE
-A-INCHES GAUGE
PLANE -B1 28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
(0.150” WIDE BODY) B M A D h x 45° -C-e α
A2 A1 B
0.17(0.007) M L C
0.10(0.004) C A M B S NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch)
per side.
5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. …
