Package Intersil L38.5x7B — Datenblatt

Plastic Packages for Integrated Circuits
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP) L38.5x7B (One of 10 Packages in MDP0046)
38 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220) A MILLIMETERS
D
N
(N-1)
(N-2) B 1
2
3 SYMBOL MIN NOMINAL MAX NOTES A 0.80 0.90 1.00 -A1 0.00 0.02 0.05 -D PIN #1
I.D. MARK D2 E 5.00 BSC
3.45 E (N/2) 2X
0.075 C 2X
0.075 C 0.10 M C A B
b (N-2)
(N-1)
N N LEADS TOP VIEW L 3.50 3.55 -7.00 BSC -E2 5.45 5.50 5.55 -L 0.35 0.40 0.45 -b 0.23 0.25 0.27 -c 0.20 REF -e 0.50 BSC -N 38 REF 4 ND 7 REF 6 NE 12 REF 5 PIN #1 I.D. Rev 1 1/11 3 NOTES: 1
2
3 1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Tiebar view shown is a non-functional feature.
3. Bottom-side pin #1 I.D. is a diepad chamfer as shown. (E2) 4. N is the total number of terminals on the device.
5. NE is the number of terminals on the “E” side of the package …