Package Intersil L20.6x6 — Datenblatt

Plastic Packages for Integrated Circuits
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP) L20.6x6
20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220VJJB ISSUE C)
MILLIMETERS
SYMBOL MIN NOMINAL MAX NOTES A 0.80 0.90 1.00 -A1 -0.05 -A2 -1.00 9 A3
b 0.20 REF
0.28 D 0.40 5, 8 6.00 BSC D1
D2 0.33 9
-5.75 BSC
3.55 3.70 9
3.85 7, 8 E 6.00 BSC -E1 5.75 BSC 9 E2 3.55 e 3.70 3.85 7, 8 0.80 BSC -k 0.25 -L 0.35 0.60 0.75 8 L1 -0.15 10 N 20 2 Nd 5 3 Ne 5 3 P -0.60 9 Оё -12 9
Rev. 1 10/02 NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature. …