Package Intersil L9.3x3 — Datenblatt

Plastic Packages for Integrated Circuits
Dual Flat No-Lead Plastic Package (DFN)
L9.3x3 2X 9 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE 0.15 C A A D MILLIMETERS 2X
0.15 C B E SYMBOL MIN
0.80 0.90 1.00 -0.05 -0.20 REF
0.20 D
D2 B A
C
SEATING
PLANE 0.08 C A3 SIDE VIEW D2 1 6 2.10 6, 7 -3.00 BSC
0.80 e 0.95 1.05 6, 7 0.50 BSC -k 0.60 -L 0.25 0.35 0.45 7 9 2 D2/2 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2 2. N is the number of terminals. E2/2 3. All dimensions are in millimeters. Angles are in degrees.
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip. E2 5. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature. NX L
N-1 6. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance. NX b e
(Nd-1)Xe
REF.
BOTTOM VIEW 4
0.10 M C A B (A1)
8 L 4
e SECTION "C-C" …