Package Intersil L8.2.5x2 — Datenblatt

Plastic Packages for Integrated Circuits
Thin Dual Flat No-Lead Plastic Package (TDFN)
2X L8.2.5x2 0.15 C A A D 8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE 2X MILLIMETERS 0.15 C B SYMBOL E
6 MIN 0.75 0.80 -A1 -0.05 -D2
// 0.10 SIDE VIEW D2
(DATUM B) C 0.08 C A3 7 8 D2/2
1 6
INDEX
AREA 0.20 0.25 0.30 5, 8 1.10 7, 8 2.00 BSC
0.90 E
E2 A
C
SEATING
PLANE 0.20 REF D B NOTES 0.70 b
TOP VIEW MAX A A3 INDEX
AREA NOMINAL 1.00 -2.50 BSC
1.20 e 1.30 1.40 7, 8 0.50 BSC -k 0.20 -L 0.30 0.40 0.50 8 N 8 Nd 4 2
3
Rev. 1 10/15 2 NX k NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals. (DATUM A) 3. Nd refers to the number of terminals on D. E2 4. All dimensions are in millimeters. Angles are in degrees. E2/2 5. Dimension b applies to the metallized terminal and is measured
between 0.25mm and 0.30mm from the terminal tip. NX L
N N-1 …