Datasheet Texas Instruments TMS570LS3137-EP — Datenblatt
Hersteller | Texas Instruments |
Serie | TMS570LS3137-EP |
Verbesserter 16- und 32-Bit-RISC-Flash-Mikrocontroller für Produkte
Datenblätter
TMS570LS3137-EP 16- and 32-Bit RISC Flash Microcontroller datasheet
PDF, 5.6 Mb, Revision: D, Datei veröffentlicht: Feb 20, 2015
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Preise
Status
TMS5703137CGWTMEP | TMS5703137CGWTQEP | V62/13629-01XE | V62/13629-02XE | |
---|---|---|---|---|
Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
Manufacture's Sample Availability | Yes | Yes | Yes | Yes |
Verpackung
TMS5703137CGWTMEP | TMS5703137CGWTQEP | V62/13629-01XE | V62/13629-02XE | |
---|---|---|---|---|
N | 1 | 2 | 3 | 4 |
Pin | 337 | 337 | 337 | 337 |
Package Type | GWT | GWT | GWT | GWT |
Industry STD Term | NFBGA | NFBGA | NFBGA | NFBGA |
JEDEC Code | S-PBGA-N | S-PBGA-N | S-PBGA-N | S-PBGA-N |
Package QTY | 90 | 90 | 90 | 90 |
Carrier | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) |
Device Marking | TMS570 | LS3137CGWTQEP | LS3137CGWTQEP | LS3137CGWTMEP |
Width (mm) | 16 | 16 | 16 | 16 |
Length (mm) | 16 | 16 | 16 | 16 |
Thickness (mm) | .9 | .9 | .9 | .9 |
Pitch (mm) | .8 | .8 | .8 | .8 |
Max Height (mm) | 1.4 | 1.4 | 1.4 | 1.4 |
Mechanical Data | Herunterladen | Herunterladen | Herunterladen | Herunterladen |
Parameter
Parameters / Models | TMS5703137CGWTMEP | TMS5703137CGWTQEP | V62/13629-01XE | V62/13629-02XE |
---|---|---|---|---|
ADC | 2 x 12-Bit (24ch) | 2 x 12-Bit (24ch) | 2 x 12-Bit (24ch) | 2 x 12-Bit (24ch) |
CAN | 3 | 3 | 3 | 3 |
CPU | ARM-Cortex - R4F | ARM-Cortex - R4F | ARM-Cortex - R4F | ARM-Cortex - R4F |
Core Supply, Volts | 1.2 | 1.2 | 1.2 | 1.2 |
Data Flash, KB | 64 | 64 | 64 | 64 |
EMAC | 10/100 | 10/100 | 10/100 | 10/100 |
EMIF | 16-bit | 16-bit | 16-bit | 16-bit |
ETM, Trace | 32-bit | 32-bit | 32-bit | 32-bit |
Flash, KB | 3072 | 3072 | 3072 | 3072 |
FlexRay | 2-ch | 2-ch | 2-ch | 2-ch |
Frequency, MHz | 180 | 180 | 180 | 180 |
GPIO | 144 | 144 | 144 | 144 |
HET Channels | 44 | 44 | 44 | 44 |
I2C | 1 | 1 | 1 | 1 |
IO Supply, V | 3.3 | 3.3 | 3.3 | 3.3 |
MibSPI | 3 | 3 | 3 | 3 |
Operating Temperature Range, C | -40 to 125,-55 to 125 | -40 to 125,-55 to 125 | -40 to 125,-55 to 125 | -40 to 125,-55 to 125 |
Package Group | NFBGA | NFBGA | NFBGA | NFBGA |
Package Size: mm2:W x L, PKG | 337NFBGA: 256 mm2: 16 x 16(NFBGA) | 337NFBGA: 256 mm2: 16 x 16(NFBGA) | 337NFBGA: 256 mm2: 16 x 16(NFBGA) | 337NFBGA: 256 mm2: 16 x 16(NFBGA) |
RAM, KB | 256 | 256 | 256 | 256 |
RTP/DMM | Yes | Yes | Yes | Yes |
Rating | HiRel Enhanced Product | HiRel Enhanced Product | HiRel Enhanced Product | HiRel Enhanced Product |
SCI | 2 | 2 | 2 | 2 |
SPI | 2 | 2 | 2 | 2 |
Öko-Plan
TMS5703137CGWTMEP | TMS5703137CGWTQEP | V62/13629-01XE | V62/13629-02XE | |
---|---|---|---|---|
RoHS | See ti.com | See ti.com | See ti.com | See ti.com |
Anwendungshinweise
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Modellreihe
Serie: TMS570LS3137-EP (4)
Herstellerklassifikation
- Semiconductors> Space & High Reliability> Microcontroller> Performance MCU> Safety Products