Datasheet Texas Instruments TMS320DM6431 — Datenblatt

Hersteller	Texas Instruments
Serie	TMS320DM6431

Datenblätter

Preise

Status

Verpackung

Parameter

Parameters / Models	TMS320DM6431ZDU3	TMS320DM6431ZDUS3	TMS320DM6431ZWT3
Applications		Automotive Communications and Telecom Consumer Electronics Energy Industrial Security Video and Imaging
Approx. Price (US$)		12.63 | 1ku
DRAM		DDR2
DSP		1 C64x
DSP MHz (Max.)		300
EMAC		10/100
I2C		1
On-Chip L2 Cache		64 KB (DSP)
Operating Systems		DSP/BIOS VLX
Operating Temperature Range(C)		-40 to 125
Pin/Package		361NFBGA 376BGA
Rating		Catalog
UART(SCI)		1
Video Port (Configurable)		1 Dedicated Input
Video Resolution/Frame Rate		D1 or Less

Öko-Plan

Anwendungshinweise

• Herunterladen
  TMS320DM643x Pin Multiplexing Utility
  PDF, 1.8 Mb, Datei veröffentlicht: Jul 6, 2007
  The DM643x devices use a great deal of internal pin multiplexing to allow the most functionality in the smallest and lowest cost package. The software accompanying this application report allows the pin multiplexing registers of the device to be calculated with ease, as well as showing what peripherals can be used together and what devices of the DM643x family support the peripherals that are sele
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  Implementing DDR2 PCB Layout on the TMS320DM643x DMSoC (Rev. A)
  PDF, 150 Kb, Revision: A, Datei veröffentlicht: Jun 26, 2008
  This application report contains implementation instructions for the DDR2 interface contained on the TMS320DM643x digital signal processor (DSP) device. The approach to specifying interface timing for the DDR2 interface is quite different than on previous devices.The previous approach specified device timing in terms of data sheet specifications and simulation models. The system designer was
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  TMS320DM643x Power Consumption Summary (Rev. C)
  PDF, 135 Kb, Revision: C, Datei veröffentlicht: May 10, 2010
  Note: PRELIMINARY DATA FOR TMX DEVICES. INFORMATION SUBJECT TO CHANGEThis application report discusses power consumption of the Texas Instruments TMS320DM643x Digital Media Processor (DMP). Power consumption is highly application-dependent, so a spreadsheet is provided to model power consumption for your applications.Note: TMX devices are experimental devices that are not necessa
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  How to Use the EDMA3 Driver on a TMS320DM643x Device (Rev. A)
  PDF, 152 Kb, Revision: A, Datei veröffentlicht: Jun 16, 2008
  This application report describes how to use the existing enhanced direct memory access (EDMA3) driver on the TMS320DM643x device. It explains several complicated transfers required for certain real-life application using the EDMA3.
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  How to Use the VPBE and VPFE Driver on the TMS320DM643x Devices (Rev. A)
  PDF, 225 Kb, Revision: A, Datei veröffentlicht: Nov 14, 2007
  This application report describes how to use the existing video processing back end (VPBE) and video processing front end (VPFE) driver on the TMS320DM643x devices. The VPBE block is comprised of the on-screen display (OSD) and the video encoder (VENC) modules. The VPFE is comprised of five modules: charge-coupled device (CCD) controller (CCDC), resizer, preview, hardware 3A statistic generator (H
• Herunterladen
  Using the TMS320DM643x Bootloader (Rev. E)
  PDF, 268 Kb, Revision: E, Datei veröffentlicht: Mar 23, 2012
  This document describes the functionality of the DM643x ROM bootloader software. Please note that the ROM bootloader requires use of Application Image Script (AIS) as the primary data format for loading code/data. AIS is a Texas Instruments, Inc. proprietary data format. AIS is explained in detail in Section 3 of this document.
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  5Vin DM643x Power using a PMIC (Multi-output DC/DC Converter)
  PDF, 302 Kb, Datei veröffentlicht: Oct 9, 2008
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  DaVinci Technology Background and Specifications (Rev. A)
  PDF, 108 Kb, Revision: A, Datei veröffentlicht: Jan 4, 2007
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  Understanding the Davinci Preview Engine (Rev. A)
  PDF, 209 Kb, Revision: A, Datei veröffentlicht: Jul 23, 2008
  The Preview Engine block in the DaVinci video processing sub-system (VPSS) provides some critical functions for image and video processing. These functions, if implemented in software, require a significant number of computations in terms of million instructions per second (MIPs). By offloading these functions, the valuable MIPs can be used for more differentiating tasks, such as video compression
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  5Vin DM643x Power using DC/DC Controllers and LDO
  PDF, 741 Kb, Datei veröffentlicht: Oct 9, 2008
• Herunterladen
  12Vin DM643x Power using Integrated-FET DC/DC Converters and LDO
  PDF, 310 Kb, Datei veröffentlicht: Oct 9, 2008
• Herunterladen
  5Vin DM643x Power using Integrated-FET DC/DC Converters and LDO
  PDF, 550 Kb, Datei veröffentlicht: Oct 9, 2008
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  EDMA v2.0 to EDMA v3.0 (EDMA3) Migration Guide (Rev. A)
  PDF, 292 Kb, Revision: A, Datei veröffentlicht: Aug 21, 2008
  This application report summarizes the key differences between the enhanced direct memory access (EDMA3) used on C64x+в„ў DSP devices and the EDMA2 used on TMS320C64xв„ў DSP devices, and provides guidance for migrating from EDMA2 to EDMA3.
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  Understanding TI's PCB Routing Rule-Based DDR Timing Specification (Rev. A)
  PDF, 93 Kb, Revision: A, Datei veröffentlicht: Jul 17, 2008
  This application report motivates the way the DDR high-speed timing requirements are now going to be communicated to system designers. The traditional method of using data sheet parameters and simulation models is tedious. The system designer uses this information to evaluate whether timing specifications are met and can be expected to operate reliably.Ultimately, the real question the hardwa
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  Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
  PDF, 1.6 Mb, Revision: B, Datei veröffentlicht: Aug 13, 2015
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  Thermal Considerations for the DM64xx, DM64x, and C6000 Devices
  PDF, 127 Kb, Datei veröffentlicht: May 20, 2007
  As integrated circuit (IC) components become more complex, the challenge of producing an end product with superior thermal performance increases. Thermal performance is a system level concern, impacted by IC packaging as well as by printed circuit board (PCB) design. This application report addresses the thermal considerations for the TMS320DM64xx, TMS320DM64x, and TMS320C6000в„ў DSP devices.
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  TMS320C64x to TMS320C64x+ CPU Migration Guide (Rev. A)
  PDF, 310 Kb, Revision: A, Datei veröffentlicht: Oct 20, 2005
  This document describes migration from the Texas Instruments TMS320C64xв„ў digital signal processor (DSP) to the TMS320C64x+в„ў DSP. The objective of this document is to indicate differences between the two cores and to briefly describe new features. Functionality in the devices that is identical is not included. For detailed information about either device, see the TMS320C64x/C64x+ DSP
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  Common Object File Format (COFF)
  PDF, 125 Kb, Datei veröffentlicht: Apr 15, 2009
• Herunterladen
  Introduction to TMS320C6000 DSP Optimization
  PDF, 535 Kb, Datei veröffentlicht: Oct 6, 2011
  The TMS320C6000™ Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications. However to fully leverage the architectural features that C6000™ processors offer code optimization may be required. First this document reviews five key concepts in understanding the C6000 DSP architecture and optimization. Then

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• Semiconductors> Processors> Digital Signal Processors> Media Processors > DaVinci Video Processors