Datasheet Texas Instruments TLE2426-EP — Datenblatt
| Hersteller | Texas Instruments |
| Serie | TLE2426-EP |
Verbesserter Precision Virtual Ground für Produktschienensplitter
Datenblätter
The Rail Splitter Precision Virtual Ground datasheet
PDF, 758 Kb, Datei veröffentlicht: Mar 20, 2006
Auszug aus dem Dokument
Preise
Status
| TLE2426MDREP | V62/06601-01XE | |
|---|---|---|
| Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No | No |
Verpackung
| TLE2426MDREP | V62/06601-01XE | |
|---|---|---|
| N | 1 | 2 |
| Pin | 8 | 8 |
| Package Type | D | D |
| Industry STD Term | SOIC | SOIC |
| JEDEC Code | R-PDSO-G | R-PDSO-G |
| Package QTY | 2500 | 2500 |
| Carrier | LARGE T&R | LARGE T&R |
| Device Marking | 2426EP | 2426EP |
| Width (mm) | 3.91 | 3.91 |
| Length (mm) | 4.9 | 4.9 |
| Thickness (mm) | 1.58 | 1.58 |
| Pitch (mm) | 1.27 | 1.27 |
| Max Height (mm) | 1.75 | 1.75 |
| Mechanical Data | Herunterladen | Herunterladen |
Parameter
| Parameters / Models | TLE2426MDREP | V62/06601-01XE |
|---|---|---|
| Operating Temperature Range, C | -55 to 125 | -55 to 125 |
| Package Group | SOIC | SOIC |
| Package Size: mm2:W x L, PKG | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) |
| Pin/Package | 8SOIC | 8SOIC |
| Rating | HiRel Enhanced Product | HiRel Enhanced Product |
Öko-Plan
| TLE2426MDREP | V62/06601-01XE | |
|---|---|---|
| RoHS | Compliant | Compliant |
Modellreihe
Serie: TLE2426-EP (2)
Herstellerklassifikation
- Semiconductors> Space & High Reliability> Special Function