Datasheet Texas Instruments CSSTV32867SGKEREP — Datenblatt
| Hersteller | Texas Instruments |
| Serie | SN74SSTV32867-EP |
| Artikelnummer | CSSTV32867SGKEREP |
Erweiterter registrierter 26-Bit-Produktpuffer mit Sstl_2-Eingängen und Lvcmos-Ausgängen 96-LFBGA -40 bis 85
Datenblätter
Preise
Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
Verpackung
| Pin | 96 |
| Package Type | GKE |
| Industry STD Term | BGA MICROSTAR |
| JEDEC Code | R-PBGA-N |
| Package QTY | 1000 |
| Carrier | LARGE T&R |
| Device Marking | S867EP |
| Width (mm) | 5.5 |
| Length (mm) | 13.5 |
| Thickness (mm) | .9 |
| Pitch (mm) | .8 |
| Max Height (mm) | 1.4 |
| Mechanical Data | Herunterladen |
Parameter
| No. of Outputs | 26 |
| Operating Temperature Range(C) | -40 to 85 |
| Output Drive(mA) | 8 |
| Package Group | LFBGA |
| Package Size: mm2:W x L (PKG) | 96LFBGA: 74 mm2: 5.5 x 13.5(LFBGA) |
| Rating | HiRel Enhanced Product |
| VCC(V) | 2.5 |
Öko-Plan
| RoHS | TBD |
| Pb Free | No |
Anwendungshinweise
- 56-Pin Quad Flatpack No-Lead Logic PackagePDF, 275 Kb, Datei veröffentlicht: Feb 7, 2003
Texas Instruments (TI) Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220, allows for board miniaturization, and holds several advantages over traditional SOIC, TQFP, TSSOP, and TVSOP packaging. This package, designated RGQ by TI, physically is smaller than traditional leaded solutions, has a smaller routing area, improved thermal performance, and improved electric - Application of the SN74SSTV32852 in Stacked, Low-Profile (1U) PC-1600/2100 DIMMsPDF, 445 Kb, Datei veröffentlicht: Nov 7, 2001
Many memory-module manufacturers are turning to low-profile (1U) DIMM designs that significantly increase memory density in computer workstations and servers. The reduction in DIMM height consequently affects the design and layout of the boards. The stacked 1U DIMMs present a unique and challenging problem due partly to the reduction in area for mounting components and also due to the load. The TI - Application of the SN74SSTVF16857 in Planar PC2700 (DDR-333) RDIMMsPDF, 359 Kb, Datei veröffentlicht: Jan 10, 2003
The high-capacity memory modules used in servers and workstations present a complex load to the memory controller used in these high-reliability, high-performance systems. To meet the demands of stable functionality over a broad spectrum of operating environments and system timing needs, and to support data integrity, these dual in-line memory modules (DIMMs) require the use of registers in the ad - Low-Power Support Using Texas Instruments SN74SSTV16857 and SN74SSTV16859PDF, 138 Kb, Datei veröffentlicht: Feb 9, 2001
The Texas Instruments SN74SSTV16857 and SN74SSTV16859 registers support the low-power mode of the DDR-DIMM. This application report explains the low-power mode and the features of the registers that support the low-power mode. Also, the considerations that the system designer must be aware of when implementing the low-power state of a registered memory module are explained. The sequence that must
Modellreihe
Serie: SN74SSTV32867-EP (2)
- CSSTV32867SGKEREP V62/06676-01XE
Herstellerklassifikation
- Semiconductors > Space & High Reliability > Clock & Timing Products > Memory Interface Clock and Register