Datasheet Texas Instruments SN74LVC2G17-EP — Datenblatt

HerstellerTexas Instruments
SerieSN74LVC2G17-EP
Datasheet Texas Instruments SN74LVC2G17-EP

Erweiterter Produkt-Dual-Schmitt-Trigger-Puffer

Datenblätter

SN74LVC2G17-EP datasheet
PDF, 744 Kb, Datei veröffentlicht: Nov 3, 2006
Auszug aus dem Dokument

Preise

Status

CLVC2G17MDCKREPG4SN74LVC2G17MDCKREPV62/07617-01XE
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNo

Verpackung

CLVC2G17MDCKREPG4SN74LVC2G17MDCKREPV62/07617-01XE
N123
Pin666
Package TypeDCKDCKDCK
Industry STD TermSOT-SC70SOT-SC70SOT-SC70
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY300030003000
CarrierLARGE T&RLARGE T&RLARGE T&R
Device MarkingBZVBZVBZV
Width (mm)1.251.251.25
Length (mm)222
Thickness (mm).9.9.9
Pitch (mm).65.65.65
Max Height (mm)1.11.11.1
Mechanical DataHerunterladenHerunterladenHerunterladen

Parameter

Parameters / ModelsCLVC2G17MDCKREPG4
CLVC2G17MDCKREPG4
SN74LVC2G17MDCKREP
SN74LVC2G17MDCKREP
V62/07617-01XE
V62/07617-01XE
3-State OutputNoNoNo
Bits222
F @ Nom Voltage(Max), Mhz150150150
Gate TypeSCHMITT TRIGGER BUFFERSCHMITT TRIGGER BUFFERSCHMITT TRIGGER BUFFER
ICC @ Nom Voltage(Max), mA0.010.010.01
Input TypeCMOS/TTLCMOS/TTLCMOS/TTL
LogicTrueTrueTrue
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125
Output Drive (IOL/IOH)(Max), mA32/-3232/-3232/-32
Output TypeCMOSCMOSCMOS
Package GroupSC70SC70SC70
Package Size: mm2:W x L, PKG6SC70: 4 mm2: 2.1 x 2(SC70)6SC70: 4 mm2: 2.1 x 2(SC70)6SC70: 4 mm2: 2.1 x 2(SC70)
RatingHiRel Enhanced ProductHiRel Enhanced ProductHiRel Enhanced Product
Schmitt TriggerYesYesYes
Sub-FamilyNon-Inverting Buffer/DriverNon-Inverting Buffer/DriverNon-Inverting Buffer/Driver
Technology FamilyLVCLVCLVC
VCC(Max), V5.55.55.5
VCC(Min), V1.651.651.65
Voltage(Nom), V1.8,2.5,3.3,51.8,2.5,3.3,51.8,2.5,3.3,5
tpd @ Nom Voltage(Max), ns13,8.7,7.4,6.313,8.7,7.4,6.313,8.7,7.4,6.3

Öko-Plan

CLVC2G17MDCKREPG4SN74LVC2G17MDCKREPV62/07617-01XE
RoHSCompliantCompliantCompliant

Anwendungshinweise

  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, Revision: B, Datei veröffentlicht: May 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
  • LVC Characterization Information
    PDF, 114 Kb, Datei veröffentlicht: Dec 1, 1996
    This document provides characterization information about low-voltage logic (LVL) that operates from a 3.3-V power supply. It addresses the issues of interfacing to 5-V logic ac performance power considerations input and output characteristics and signal integrity for this family of devices.
  • Use of the CMOS Unbuffered Inverter in Oscillator Circuits
    PDF, 796 Kb, Datei veröffentlicht: Nov 6, 2003
    CMOS devices have a high input impedance high gain and high bandwidth. These characteristics are similar to ideal amplifier characteristics and hence a CMOS buffer or inverter can be used in an oscillator circuit in conjunction with other passive components. Now CMOS oscillator circuits are widely used in high-speed applications because they are economical easy to use and take significantly
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, Revision: A, Datei veröffentlicht: Aug 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Understanding Advanced Bus-Interface Products Design Guide
    PDF, 253 Kb, Datei veröffentlicht: May 1, 1996
  • Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
    PDF, 209 Kb, Datei veröffentlicht: May 10, 2002
    Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features
  • How to Select Little Logic (Rev. A)
    PDF, 1.1 Mb, Revision: A, Datei veröffentlicht: Jul 26, 2016
    TI Little Logic devices are logic-gate devices assembled in a small single- dual- or triple- gate package. Little Logic devices are widely used in portable equipment such as mobile phones MP3 players and notebook computers. Little Logic devices also are used in desktop computers and telecommunications. Little Logic gates are common components for easy PC board routing schematic design and b
  • Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices
    PDF, 115 Kb, Datei veröffentlicht: Dec 1, 1997
    This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
  • Texas Instruments Little Logic Application Report
    PDF, 359 Kb, Datei veröffentlicht: Nov 1, 2002
    Portable and consumer electronic systems? needs present greater challenges today than ever before. Engineers strive to design smaller faster lower-cost systems to meet the market demand. Consequently the semiconductor industry faces a growing need to increase operating speed minimize power consumption and reduce packaging size. Texas Instruments manufactures a variety of Little Logic semicond

Modellreihe

Herstellerklassifikation

  • Semiconductors> Space & High Reliability> Logic Products> Little Logic Products