Datasheet Texas Instruments SN74GTL2014 — Datenblatt

Hersteller	Texas Instruments
Serie	SN74GTL2014

Datenblätter

Preise

Status

Verpackung

Parameter

Parameters / Models	SN74GTL2014PWR
Bits	4
F @ Nom Voltage(Max), Mhz	150
ICC @ Nom Voltage(Max), mA	10
Operating Temperature Range, C	-40 to 85
Output Drive (IOL/IOH)(Max), mA	50
Package Group	TSSOP
Package Size: mm2:W x L, PKG	14TSSOP: 32 mm2: 6.4 x 5(TSSOP)
Rating	Catalog
Schmitt Trigger	No
Technology Family	GTL
VCC(Max), V	3.6
VCC(Min), V	3
Voltage(Nom), V	3.3
tpd @ Nom Voltage(Max), ns	7

Öko-Plan

Anwendungshinweise

• Herunterladen
  GTLP in BTL Applications
  PDF, 248 Kb, Datei veröffentlicht: Jul 31, 2000
• Herunterladen
  High-Performance Backplane Design With GTL+ (Rev. A)
  PDF, 135 Kb, Revision: A, Datei veröffentlicht: Oct 25, 1999
  Results from a system that demonstrates the performance of GTL+ devices in a backplane are provided. The Texas Instruments (TI) GTL16622A is the example used in the design of the physical backplane. The TI backplane demonstration system is a useful tool for designers in understanding issues related to loading effects, termination, signal integrity, and data-transfer rate in a high-performance
• Herunterladen
  Basic Design Considerations for Backplanes (Rev. B)
  PDF, 362 Kb, Revision: B, Datei veröffentlicht: Apr 5, 2001
  This application report describes design issues relevant to the parallel backplanes typically used in the wireless, datacom, telecom, and networking markets. Designing a high-performance backplane is extremely complex, because issues such as distributed capacitance, stub lengths, noise margin, rise time (slew rate), flight time, and propagation delay must be defined and optimized to achieve good s
• Herunterladen
  Logic in Live-Insertion Applications With a Focus on GTLP
  PDF, 493 Kb, Datei veröffentlicht: Jan 14, 2002
  Live-insertion capability is an essential part of today?s high-speed data systems because those systems are expected to run continuously without being powered down. This application report delves into the cause and prevention of live-insertion and nanosecond-discontinuity effects, using both simulation and actual test measurements from a specially built GTLP EVM. Hypothetical cases for precharge c
• Herunterladen
  Achieving Maximum Speed on Parallel Buses With Gunning Transceiver Logic (GTLP)
  PDF, 585 Kb, Datei veröffentlicht: Apr 5, 2001
  This application report compares two approaches for synchronous bus-system designs. The focus of the report is the comparison of a system using central-synchronous system clock (CSSC) with a system operated with a source-synchronous system clock (SSSC).The basic characteristics of lines, key factors that influence the bus line delay, and the impedance of bus lines are described.The theoretical
• Herunterladen
  Fast GTLP Backplanes With the GTLPH1655 (Rev. A)
  PDF, 1.1 Mb, Revision: A, Datei veröffentlicht: Sep 19, 2000
  This revision of the Fast GTL Backplanes With the GTL1655 application report addresses improvements, such as the improved OECE circuitry and implementation of theTexas Instruments TI-OPCE circuitry, that have been incorporated in the GTLPH1655 device. These improvements significantly improve signal integrity in distributed loads.This application report describes the physical principles of fast
• Herunterladen
  GTL/BTL: A Low-Swing Solution for High-Speed Digital Logic (Rev. A)
  PDF, 184 Kb, Revision: A, Datei veröffentlicht: Mar 1, 1997
  GTL and BTL transceivers provide high-performance, excellent signal integrity and cost-effectiveness in high-speed backplane and point-to-point applications. This document discusses the GTL and BTL devices input/output (I/O) structure, power consumption, simultaneous switching, slew rate, and signal integrity. Design considerations for using these devices are provided.
• Herunterladen
  Voltage Translation Between 3.3-V, 2.5-V, 1.8-V, and 1.5-V Logic Standards (Rev. B)
  PDF, 390 Kb, Revision: B, Datei veröffentlicht: Apr 30, 2015
• Herunterladen
  Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
  PDF, 209 Kb, Datei veröffentlicht: May 10, 2002
  Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features

Modellreihe

Herstellerklassifikation

• Semiconductors> Logic> Backplane Logic (GTL/TTL/BTL/ECL Transceiver/Translator)