Datasheet Texas Instruments SN74FB1650 — Datenblatt

HerstellerTexas Instruments
SerieSN74FB1650
Datasheet Texas Instruments SN74FB1650

18-Bit-TTL / BTL-Universalspeicher-Transceiver

Datenblätter

SN74FB1650 datasheet
PDF, 235 Kb, Revision: O, Datei veröffentlicht: Mar 10, 2004
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Preise

Status

SN74FB1650PCA
Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

Verpackung

SN74FB1650PCA
N1
Pin100
Package TypePCA
Industry STD TermHLQFP
JEDEC CodeS-PQFP-G
Package QTY90
CarrierJEDEC TRAY (10+1)
Device MarkingFB1650
Width (mm)14
Length (mm)14
Thickness (mm)1.4
Pitch (mm).5
Max Height (mm)1.6
Mechanical DataHerunterladen

Parameter

Parameters / ModelsSN74FB1650PCA
SN74FB1650PCA
Bits18
F @ Nom Voltage(Max), Mhz150
ICC @ Nom Voltage(Max), mA120
Operating Temperature Range, C0 to 70
Output Drive (IOL/IOH)(Max), mA100/-32
Package GroupHLQFP
Package Size: mm2:W x L, PKG100HLQFP: 256 mm2: 16 x 16(HLQFP)
RatingCatalog
Schmitt TriggerNo
Technology FamilyFB
VCC(Max), V5.5
VCC(Min), V4.5
Voltage(Nom), V5
tpd @ Nom Voltage(Max), ns8.3

Öko-Plan

SN74FB1650PCA
RoHSCompliant

Anwendungshinweise

  • Next-Generation BTL/Futurebus Transceivers Allow Single-Sided SMT Manufacturing (Rev. C)
    PDF, 65 Kb, Revision: C, Datei veröffentlicht: Mar 1, 1997
    BTL- and Futurebus-compatible transceivers and switching level meet the requirements of today?s high-speed data-communications and provide significant performance advantages over conventional backplane implementations. This document discusses the current and next generation of BTL/Futurebus Transceivers and the design trade-offs required when using these devices.
  • GTL/BTL: A Low-Swing Solution for High-Speed Digital Logic (Rev. A)
    PDF, 184 Kb, Revision: A, Datei veröffentlicht: Mar 1, 1997
    GTL and BTL transceivers provide high-performance, excellent signal integrity and cost-effectiveness in high-speed backplane and point-to-point applications. This document discusses the GTL and BTL devices input/output (I/O) structure, power consumption, simultaneous switching, slew rate, and signal integrity. Design considerations for using these devices are provided.
  • Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
    PDF, 209 Kb, Datei veröffentlicht: May 10, 2002
    Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features

Modellreihe

Serie: SN74FB1650 (1)

Herstellerklassifikation

  • Semiconductors> Logic> Backplane Logic (GTL/TTL/BTL/ECL Transceiver/Translator)