Datasheet Texas Instruments SN74CBT16390 — Datenblatt
Hersteller | Texas Instruments |
Serie | SN74CBT16390 |
16-Bit- bis 32-Bit-FET-Multiplexer / Demultiplexer-Busschalter
Datenblätter
16-Bit To 32-Bit FET Multiplexer/Demultiplexer Bus Switch datasheet
PDF, 331 Kb, Revision: E, Datei veröffentlicht: Oct 23, 2000
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Preise
Status
SN74CBT16390DGGR | SN74CBT16390DGVR | SN74CBT16390DL | SN74CBT16390DLG4 | |
---|---|---|---|---|
Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
Manufacture's Sample Availability | No | No | No | No |
Verpackung
SN74CBT16390DGGR | SN74CBT16390DGVR | SN74CBT16390DL | SN74CBT16390DLG4 | |
---|---|---|---|---|
N | 1 | 2 | 3 | 4 |
Pin | 56 | 56 | 56 | 56 |
Package Type | DGG | DGV | DL | DL |
Industry STD Term | TSSOP | TVSOP | SSOP | SSOP |
JEDEC Code | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G |
Package QTY | 2000 | 2000 | 20 | 20 |
Carrier | LARGE T&R | LARGE T&R | TUBE | TUBE |
Device Marking | CBT16390 | CY390 | CBT16390 | CBT16390 |
Width (mm) | 6.1 | 4.4 | 7.49 | 7.49 |
Length (mm) | 14 | 11.3 | 18.41 | 18.41 |
Thickness (mm) | 1.15 | 1.05 | 2.59 | 2.59 |
Pitch (mm) | .5 | .4 | .635 | .635 |
Max Height (mm) | 1.2 | 1.2 | 2.79 | 2.79 |
Mechanical Data | Herunterladen | Herunterladen | Herunterladen | Herunterladen |
Parameter
Parameters / Models | SN74CBT16390DGGR | SN74CBT16390DGVR | SN74CBT16390DL | SN74CBT16390DLG4 |
---|---|---|---|---|
Additional Features | Internal pull-down resistors,Make-before-break | Internal pull-down resistors,Make-before-break | Internal pull-down resistors,Make-before-break | Internal pull-down resistors,Make-before-break |
Bandwidth, MHz | 200 | 200 | 200 | 200 |
Bandwidth(Max), MHz | 200 | 200 | 200 | 200 |
Configuration | 2:1 SPDT | 2:1 SPDT | 2:1 SPDT | 2:1 SPDT |
ESD HBM, kV | 2 | 2 | 2 | 2 |
Input/Ouput Voltage(Max), V | 5.5 | 5.5 | 5.5 | 5.5 |
Input/Output Continuous Current(Max), mA | 128 | 128 | 128 | 128 |
Input/Output OFF-state Capacitance(Typ), pF | 5.5 | 5.5 | 5.5 | 5.5 |
Number of Channels | 16 | 16 | 16 | 16 |
OFF-state leakage current(Max), µA | 1 | 1 | 1 | 1 |
ON-state leakage current(Max), µA | 1 | 1 | 1 | 1 |
Operating Temperature Range, C | -40 to 85 | -40 to 85 | -40 to 85 | -40 to 85 |
Package Group | TSSOP | TVSOP | SSOP | SSOP |
Package Size: mm2:W x L, PKG | 56TSSOP: 113 mm2: 8.1 x 14(TSSOP) | 56TVSOP: 72 mm2: 6.4 x 11.3(TVSOP) | 56SSOP: 191 mm2: 10.35 x 18.42(SSOP) | 56SSOP: 191 mm2: 10.35 x 18.42(SSOP) |
Rating | Catalog | Catalog | Catalog | Catalog |
Ron(Max), Ohms | 12 | 12 | 12 | 12 |
Ron(Typ), Ohms | 5 | 5 | 5 | 5 |
Supply Current(Max), uA | 50 | 50 | 50 | 50 |
Supply Range, Max | 5.5 | 5.5 | 5.5 | 5.5 |
VIH(Min), V | 2 | 2 | 2 | 2 |
VIL(Max), V | 0.8 | 0.8 | 0.8 | 0.8 |
Vdd(Max), V | 5.5 | 5.5 | 5.5 | 5.5 |
Vdd(Min), V | 4.5 | 4.5 | 4.5 | 4.5 |
Vss(Max), V | N/A | N/A | N/A | N/A |
Vss(Min), V | N/A | N/A | N/A | N/A |
Öko-Plan
SN74CBT16390DGGR | SN74CBT16390DGVR | SN74CBT16390DL | SN74CBT16390DLG4 | |
---|---|---|---|---|
RoHS | Compliant | Compliant | Compliant | Compliant |
Anwendungshinweise
- Flexible Voltage-Level Translation With CBT Family DevicesPDF, 40 Kb, Datei veröffentlicht: Jul 20, 1999
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The emergence of low-voltage technology required existing 5-V systems to interact with 3.3-V systems. Compatibility issues of mixed-mode operation created the need for 5-V to 3.3-V translation. Buffers and transceivers serve as effective translators. While providing additional drive, these devices also add propagation delay and require directional control. In cases where additional drive is not - 3.3-V to 2.5-V Translation with Texas Instruments Crossbar Technology (Rev. A)PDF, 32 Kb, Revision: A, Datei veröffentlicht: Apr 3, 1998
- VOLTAGE LEVEL TRANSLATION (SL) - FamilyPDF, 111 Kb, Datei veröffentlicht: Sep 21, 2011
- Bus FET Switch Solutions for Live Insertion ApplicationsPDF, 300 Kb, Datei veröffentlicht: Feb 7, 2003
In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ - 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)PDF, 895 Kb, Revision: B, Datei veröffentlicht: May 22, 2002
TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
Modellreihe
Serie: SN74CBT16390 (4)
Herstellerklassifikation
- Semiconductors> Switches and Multiplexers> Analog Switches/Muxes