Datasheet Texas Instruments SN74ALVCHR16269A — Datenblatt

Hersteller	Texas Instruments
Serie	SN74ALVCHR16269A

Datenblätter

Preise

Status

Verpackung

Parameter

Parameters / Models	74ALVCHR16269ALG4
Bits(#)	24
F @ Nom Voltage(Max)(Mhz)	135
ICC @ Nom Voltage(Max)(mA)	0.04
Operating Temperature Range(C)	-40 to 85
Package Group	SSOP
Package Size: mm2:W x L (PKG)	56SSOP: 191 mm2: 10.35 x 18.42(SSOP)
Rating	Catalog
Schmitt Trigger	No
Technology Family	ALVC
VCC(Max)(V)	3.6
VCC(Min)(V)	1.65
Voltage(Nom)(V)	1.8 2.5 2.7 3.3
tpd @ Nom Voltage(Max)(ns)	7.7 6.9 5.8

Öko-Plan

Anwendungshinweise

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  The PC100 standard establishes design parameters for the PC SDRAM DIMM that is designed to operate at 100 MHz. The 168-pin, 8-byte, registered SDRAM DIMM is a JEDEC-defined device (JC-42.5-96-146A). Some of the defined signal paths include data signals, address signals, and control signals. This application report discusses the SN74ALVC16835 18-bit universal bus driver that is available from T
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  Design of high-performance personal computer (PC) systems that are capable of meeting the needs imposed by modern operating systems and software includes the use of large banks of SDRAMs on DIMMs (see Figure 1).To meet the demands of stable functionality over the broad spectrum of operating environments, meet system timing needs, and to support data integrity, the loads presented by the large
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  TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
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  PDF, 105 Kb, Revision: A, Datei veröffentlicht: Aug 1, 1997
  The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
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  PDF, 253 Kb, Datei veröffentlicht: May 1, 1996
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  PDF, 115 Kb, Datei veröffentlicht: Dec 1, 1997
  This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
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  PDF, 154 Kb, Revision: A, Datei veröffentlicht: Sep 8, 1999
  In the last few years the trend toward reducing supply voltage (VCC) has continued as reflected in an additional specification of 2.5-V VCC for the AVC ALVT ALVC LVC LV and the CBTLV families.In this application report the different logic levels at VCC of 5 V 3.3 V 2.5 V and 1.8 V are compared. Within the report the possibilities for migration from 5-V logic and 3.3-V logic families
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  PDF, 89 Kb, Revision: B, Datei veröffentlicht: Jun 1, 1997
  Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
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  Input and Output Characteristics of Digital Integrated Circuits
  PDF, 1.7 Mb, Datei veröffentlicht: Oct 1, 1996
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Herstellerklassifikation

• Semiconductors> Logic> Universal Bus Function> Universal Bus Exchanger (UBE)