Datasheet Texas Instruments SN74ALVC16334 — Datenblatt

Hersteller	Texas Instruments
Serie	SN74ALVC16334

Datenblätter

Preise

Status

Verpackung

Parameter

Parameters / Models	SN74ALVC16334DGGR	SN74ALVC16334DGVR	SN74ALVC16334DL
F @ Nom Voltage(Max), Mhz	150	150	150
ICC @ Nom Voltage(Max), mA	0.04	0.04	0.04
Operating Temperature Range, C	-40 to 85	-40 to 85	-40 to 85
Package Group	TSSOP	TVSOP	SSOP
Package Size: mm2:W x L, PKG	48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)	48TVSOP: 62 mm2: 6.4 x 9.7(TVSOP)	48SSOP: 164 mm2: 10.35 x 15.88(SSOP)
Rating	Catalog	Catalog	Catalog
Schmitt Trigger	No	No	No
Technology Family	ALVC	ALVC	ALVC
VCC(Max), V	3.6	3.6	3.6
VCC(Min), V	1.65	1.65	1.65
Voltage(Nom), V	1.8,2.5,2.7,3.3	1.8,2.5,2.7,3.3	1.8,2.5,2.7,3.3
tpd @ Nom Voltage(Max), ns	3.7,3.6,3.3	3.7,3.6,3.3	3.7,3.6,3.3

Öko-Plan

Anwendungshinweise

• Herunterladen
  TI SN74ALVC16835 Component Specification Analysis for PC100
  PDF, 43 Kb, Datei veröffentlicht: Aug 3, 1998
  The PC100 standard establishes design parameters for the PC SDRAM DIMM that is designed to operate at 100 MHz. The 168-pin, 8-byte, registered SDRAM DIMM is a JEDEC-defined device (JC-42.5-96-146A). Some of the defined signal paths include data signals, address signals, and control signals. This application report discusses the SN74ALVC16835 18-bit universal bus driver that is available from T
• Herunterladen
  Logic Solutions for PC-100 SDRAM Registered DIMMs (Rev. A)
  PDF, 96 Kb, Revision: A, Datei veröffentlicht: May 13, 1998
  Design of high-performance personal computer (PC) systems that are capable of meeting the needs imposed by modern operating systems and software includes the use of large banks of SDRAMs on DIMMs (see Figure 1).To meet the demands of stable functionality over the broad spectrum of operating environments, meet system timing needs, and to support data integrity, the loads presented by the large
• Herunterladen
  16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
  PDF, 895 Kb, Revision: B, Datei veröffentlicht: May 22, 2002
  TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
• Herunterladen
  Understanding Advanced Bus-Interface Products Design Guide
  PDF, 253 Kb, Datei veröffentlicht: May 1, 1996
• Herunterladen
  Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A)
  PDF, 154 Kb, Revision: A, Datei veröffentlicht: Sep 8, 1999
  In the last few years the trend toward reducing supply voltage (VCC) has continued as reflected in an additional specification of 2.5-V VCC for the AVC ALVT ALVC LVC LV and the CBTLV families.In this application report the different logic levels at VCC of 5 V 3.3 V 2.5 V and 1.8 V are compared. Within the report the possibilities for migration from 5-V logic and 3.3-V logic families

Modellreihe

Herstellerklassifikation

• Semiconductors> Logic> Universal Bus Function> Universal Bus Driver (UBD)