Datasheet Texas Instruments SN74ABT827 — Datenblatt

Hersteller	Texas Instruments
Serie	SN74ABT827

Datenblätter

Preise

Status

Verpackung

Parameter

Parameters / Models	SN74ABT827DBLE	SN74ABT827DBR	SN74ABT827DW	SN74ABT827DWR	SN74ABT827PW	SN74ABT827PWG4	SN74ABT827PWLE	SN74ABT827PWR
Approx. Price (US$)	0.77 | 1ku						0.77 | 1ku
Bits		10	10	10	10	10		10
Bits(#)	10						10
F @ Nom Voltage(Max), Mhz		150	150	150	150	150		150
F @ Nom Voltage(Max)(Mhz)	150						150
ICC @ Nom Voltage(Max), mA		0.25	0.25	0.25	0.25	0.25		0.25
ICC @ Nom Voltage(Max)(mA)	0.25						0.25
Input Type	TTL						TTL
Operating Temperature Range, C		-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 85		-40 to 85
Operating Temperature Range(C)	-40 to 85						-40 to 85
Output Drive (IOL/IOH)(Max), mA		-32/64	-32/64	-32/64	-32/64	-32/64		-32/64
Output Drive (IOL/IOH)(Max)(mA)	-32/64						-32/64
Output Type	TTL						TTL
Package Group	SSOP	SSOP	SOIC	SOIC	TSSOP	TSSOP	TSSOP	TSSOP
Package Size: mm2:W x L, PKG		24SSOP: 64 mm2: 7.8 x 8.2(SSOP)	24SOIC: 160 mm2: 10.3 x 15.5(SOIC)	24SOIC: 160 mm2: 10.3 x 15.5(SOIC)	24TSSOP: 50 mm2: 6.4 x 7.8(TSSOP)	24TSSOP: 50 mm2: 6.4 x 7.8(TSSOP)		24TSSOP: 50 mm2: 6.4 x 7.8(TSSOP)
Package Size: mm2:W x L (PKG)	See datasheet (PDIP)						See datasheet (PDIP)
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
Schmitt Trigger	No	No	No	No	No	No	No	No
Technology Family	ABT	ABT	ABT	ABT	ABT	ABT	ABT	ABT
VCC(Max), V		5.5	5.5	5.5	5.5	5.5		5.5
VCC(Max)(V)	5.5						5.5
VCC(Min), V		4.5	4.5	4.5	4.5	4.5		4.5
VCC(Min)(V)	4.5						4.5
Voltage(Nom), V		5	5	5	5	5		5
Voltage(Nom)(V)	5						5
tpd @ Nom Voltage(Max), ns		4.8	4.8	4.8	4.8	4.8		4.8
tpd @ Nom Voltage(Max)(ns)	4.8						4.8

Öko-Plan

Anwendungshinweise

• Herunterladen
  Quad Flatpack No-Lead Logic Packages (Rev. D)
  PDF, 1.0 Mb, Revision: D, Datei veröffentlicht: Feb 16, 2004
  Texas Instruments (TI) Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241 allow for board miniaturization and hold several advantages over traditional SOIC SSOP TSSOP and TVSOP packages. The packages are physically smaller have a smaller routing area improved thermal performance and improved electrical parasitics while
• Herunterladen
  Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B)
  PDF, 528 Kb, Revision: B, Datei veröffentlicht: Jun 1, 1997
  The purpose of this document is to assist the designers of high-performance digital logic systems in using the advanced BiCMOS technology (ABT) logic family. Detailed electrical characteristics of these bus-interface devices are provided and tables and graphs have been included to compare specific parameters of the ABT family with those of other logic families. In addition typical data is provide
• Herunterladen
  Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A)
  PDF, 115 Kb, Revision: A, Datei veröffentlicht: Mar 1, 1997
  Advanced bus-interface logic (ABIL) products processed in submicron advanced BiCMOS technologies (ABT) address the specific end-equipment demands of workstations personal and portable computers and telecommunications markets. This document discusses ABIL as system bus interfaces the merits of ABT its I/O structure packaging and ABT products for end-equipment specific solutions.
• Herunterladen
  Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A)
  PDF, 80 Kb, Revision: A, Datei veröffentlicht: Dec 1, 1996
  This document shows the output skew for the ABT16254 ABT16952 and ABT16500A devices of the TI advanced BiCMOS (ABT) family. The data samples show which output skew is being examined where the data originates and how it is analyzed. Some errors present in the data are discussed. Skew curves at varying temperatures are given for the ABT16240 ABT16245 ABT16952 ABT16500A and ABT16249 devic
• Herunterladen
  Understanding Advanced Bus-Interface Products Design Guide
  PDF, 253 Kb, Datei veröffentlicht: May 1, 1996
• Herunterladen
  Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
  PDF, 209 Kb, Datei veröffentlicht: May 10, 2002
  Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features

Modellreihe

Herstellerklassifikation

• Semiconductors> Logic> Buffer/Driver/Transceiver> Non-Inverting Buffer/Driver