Datasheet Texas Instruments SN54S30 — Datenblatt

HerstellerTexas Instruments
SerieSN54S30
Datasheet Texas Instruments SN54S30

Positive NAND-Gatter mit 8 Eingängen

Datenblätter

8-Input Positive-NAND Gates datasheet
PDF, 1.1 Mb, Datei veröffentlicht: Mar 1, 1988
Auszug aus dem Dokument

Preise

Status

5962-9679201QCA5962-9679201QDASN54S30JSNJ54S30JSNJ54S30W
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNo

Verpackung

5962-9679201QCA5962-9679201QDASN54S30JSNJ54S30JSNJ54S30W
N12345
Pin1414141414
Package TypeJWJJW
Industry STD TermCDIPCFPCDIPCDIPCFP
JEDEC CodeR-GDIP-TR-GDFP-FR-GDIP-TR-GDIP-TR-GDFP-F
Package QTY11111
CarrierTUBETUBETUBETUBETUBE
Device Marking5962-9679201QCSNJ54S30WSN54S30J5962-9679201QCSNJ54S30W
Width (mm)6.675.976.676.675.97
Length (mm)19.569.2119.5619.569.21
Thickness (mm)4.571.594.574.571.59
Pitch (mm)2.541.272.542.541.27
Max Height (mm)5.082.035.085.082.03
Mechanical DataHerunterladenHerunterladenHerunterladenHerunterladenHerunterladen

Parameter

Parameters / Models5962-9679201QCA
5962-9679201QCA
5962-9679201QDA
5962-9679201QDA
SN54S30J
SN54S30J
SNJ54S30J
SNJ54S30J
SNJ54S30W
SNJ54S30W
Input TypeTTLTTLTTLTTLTTL
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125
Output TypeTTLTTLTTLTTLTTL
Package GroupCDIPCFPCDIPCDIPCFP
Package Size: mm2:W x L, PKGSee datasheet (CDIP)See datasheet (CFP)See datasheet (CDIP)See datasheet (CDIP)See datasheet (CFP)
RatingMilitaryMilitaryMilitaryMilitaryMilitary
Schmitt TriggerNoNoNoNoNo
Technology FamilySSSSS
VCC(Max), V5.55.55.55.55.5
VCC(Min), V4.54.54.54.54.5

Öko-Plan

5962-9679201QCA5962-9679201QDASN54S30JSNJ54S30JSNJ54S30W
RoHSSee ti.comSee ti.comSee ti.comSee ti.comSee ti.com

Anwendungshinweise

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    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, Datei veröffentlicht: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Datei veröffentlicht: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revision: C, Datei veröffentlicht: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Kb, Datei veröffentlicht: Apr 30, 2015

Modellreihe

Herstellerklassifikation

  • Semiconductors> Space & High Reliability> Logic Products> Gate Products