Datasheet Texas Instruments SN54LVTH16373 — Datenblatt

HerstellerTexas Instruments
SerieSN54LVTH16373
Datasheet Texas Instruments SN54LVTH16373

3,3 V ABT 16-Bit-Latches vom transparenten D-Typ mit 3-Zustands-Ausgängen

Datenblätter

SN54LVTH16373, SN74LVTH16373 datasheet
PDF, 944 Kb, Revision: P, Datei veröffentlicht: Nov 1, 2006
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Preise

Status

5962-9681001QXASNJ54LVTH16373WD
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNo

Verpackung

5962-9681001QXASNJ54LVTH16373WD
N12
Pin4848
Package TypeWDWD
Industry STD TermCFPCFP
JEDEC CodeR-GDFP-FR-GDFP-F
Package QTY11
CarrierTUBETUBE
Device Marking5962-9681001QX5962-9681001QX
Width (mm)9.669.66
Length (mm)15.8815.88
Thickness (mm)2.482.48
Pitch (mm).635.635
Max Height (mm)3.053.05
Mechanical DataHerunterladenHerunterladen

Parameter

Parameters / Models5962-9681001QXA
5962-9681001QXA
SNJ54LVTH16373WD
SNJ54LVTH16373WD
3-State OutputYesYes
Bits1616
F @ Nom Voltage(Max), Mhz160160
ICC @ Nom Voltage(Max), mA55
Input TypeTTLTTL
Operating Temperature Range, C-55 to 125-55 to 125
Output Drive (IOL/IOH)(Max), mA64/-1264/-12
Output TypeTTLTTL
Package GroupCFPCFP
Package Size: mm2:W x L, PKGSee datasheet (CFP)See datasheet (CFP)
RatingMilitaryMilitary
Technology FamilyLVTLVT
VCC(Max), V3.63.6
VCC(Min), V2.72.7
tpd @ Nom Voltage(Max), ns3.83.8

Öko-Plan

5962-9681001QXASNJ54LVTH16373WD
RoHSSee ti.comSee ti.com

Anwendungshinweise

  • LVT Family Characteristics (Rev. A)
    PDF, 98 Kb, Revision: A, Datei veröffentlicht: Mar 1, 1998
    To address the need for a complete low-voltage interface solution, Texas Instruments has developed a new generation of logic devices capable of mixed-mode operation. The LVT series relies on a state-of-the-art submicron BiCMOS process to provide up to a 90% reduction in static power dissipation over ABT. LVT devices solve the system need for a transparent seam between the low-voltage and 5-V secti
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  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
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    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
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Modellreihe

Serie: SN54LVTH16373 (2)

Herstellerklassifikation

  • Semiconductors> Space & High Reliability> Logic Products> Flip-Flop/Latch/Registers