Datasheet Texas Instruments SNJ54ABT273FK — Datenblatt

HerstellerTexas Instruments
SerieSN54ABT273
ArtikelnummerSNJ54ABT273FK
Datasheet Texas Instruments SNJ54ABT273FK

Oktal kantengetriggerte D-Flip-Flops mit klarem 20-LCCC -55 bis 125

Datenblätter

Octal Edge-Triggered D-Type Flip-Flops With Clear datasheet
PDF, 1.4 Mb, Revision: B, Datei veröffentlicht: Jan 1, 1997
Auszug aus dem Dokument

Preise

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

Verpackung

Pin20202020
Package TypeFKFKFKFK
Industry STD TermLCCCLCCCLCCCLCCC
JEDEC CodeS-CQCC-NS-CQCC-NS-CQCC-NS-CQCC-N
Package QTY1111
CarrierTUBETUBETUBETUBE
Device MarkingSNJ54ABT273FK5962-9321701Q2A
Width (mm)8.898.898.898.89
Length (mm)8.898.898.898.89
Thickness (mm)1.831.831.831.83
Pitch (mm)1.271.271.271.27
Max Height (mm)2.032.032.032.03
Mechanical DataHerunterladenHerunterladenHerunterladenHerunterladen

Parameter

3-State OutputNo
Bits8
F @ Nom Voltage(Max)150 Mhz
ICC @ Nom Voltage(Max)30 mA
Input TypeTTL
Operating Temperature Range-55 to 125 C
Output Drive (IOL/IOH)(Max)64/-32 mA
Output TypeTTL
Package GroupLCCC
Package Size: mm2:W x L20LCCC: 79 mm2: 8.89 x 8.89(LCCC) PKG
RatingMilitary
Technology FamilyABT
VCC(Max)5.5 V
VCC(Min)4.5 V
tpd @ Nom Voltage(Max)7.3 ns

Öko-Plan

RoHSSee ti.com

Anwendungshinweise

  • Quad Flatpack No-Lead Logic Packages (Rev. D)
    PDF, 1.0 Mb, Revision: D, Datei veröffentlicht: Feb 16, 2004
    Texas Instruments (TI) Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241 allow for board miniaturization and hold several advantages over traditional SOIC SSOP TSSOP and TVSOP packages. The packages are physically smaller have a smaller routing area improved thermal performance and improved electrical parasitics while
  • Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B)
    PDF, 528 Kb, Revision: B, Datei veröffentlicht: Jun 1, 1997
    The purpose of this document is to assist the designers of high-performance digital logic systems in using the advanced BiCMOS technology (ABT) logic family. Detailed electrical characteristics of these bus-interface devices are provided and tables and graphs have been included to compare specific parameters of the ABT family with those of other logic families. In addition typical data is provide
  • Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A)
    PDF, 115 Kb, Revision: A, Datei veröffentlicht: Mar 1, 1997
    Advanced bus-interface logic (ABIL) products processed in submicron advanced BiCMOS technologies (ABT) address the specific end-equipment demands of workstations personal and portable computers and telecommunications markets. This document discusses ABIL as system bus interfaces the merits of ABT its I/O structure packaging and ABT products for end-equipment specific solutions.
  • Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A)
    PDF, 80 Kb, Revision: A, Datei veröffentlicht: Dec 1, 1996
    This document shows the output skew for the ABT16254 ABT16952 and ABT16500A devices of the TI advanced BiCMOS (ABT) family. The data samples show which output skew is being examined where the data originates and how it is analyzed. Some errors present in the data are discussed. Skew curves at varying temperatures are given for the ABT16240 ABT16245 ABT16952 ABT16500A and ABT16249 devic

Modellreihe

Herstellerklassifikation

  • Semiconductors > Space & High Reliability > Logic Products > Flip-Flop/Latch/Registers