Datasheet Texas Instruments 5962-9557501QFA — Datenblatt

HerstellerTexas Instruments
SerieSN5476
Artikelnummer5962-9557501QFA
Datasheet Texas Instruments 5962-9557501QFA

Dual JK Flip-Flops mit voreingestelltem und klarem 16-CFP -55 bis 125

Datenblätter

Dual J-K Flip-Flops With Preset And Clear datasheet
PDF, 339 Kb, Datei veröffentlicht: Mar 1, 1988
Auszug aus dem Dokument

Preise

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

Verpackung

Pin161616
Package TypeWWW
Industry STD TermCFPCFPCFP
JEDEC CodeR-GDFP-FR-GDFP-FR-GDFP-F
Package QTY111
CarrierTUBETUBETUBE
Device MarkingA5962-9557501QFSNJ5476W
Width (mm)6.736.736.73
Length (mm)10.310.310.3
Thickness (mm)1.651.651.65
Pitch (mm)1.271.271.27
Max Height (mm)2.032.032.03
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Öko-Plan

RoHSSee ti.com

Anwendungshinweise

  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, Datei veröffentlicht: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Power-Up Behavior of Clocked Devices (Rev. A)
    PDF, 34 Kb, Revision: A, Datei veröffentlicht: Feb 6, 2015
  • Live Insertion
    PDF, 150 Kb, Datei veröffentlicht: Oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, Datei veröffentlicht: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Datei veröffentlicht: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revision: C, Datei veröffentlicht: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Kb, Datei veröffentlicht: Apr 30, 2015

Modellreihe

Herstellerklassifikation

  • Semiconductors > Space & High Reliability > Logic Products > Flip-Flop/Latch/Registers

Andere Namen:

59629557501QFA, 5962 9557501QFA