Datasheet Texas Instruments SN5432 — Datenblatt

Hersteller	Texas Instruments
Serie	SN5432

Datenblätter

Preise

Status

Verpackung

Parameter

Parameters / Models	5962-9557401QCA	5962-9557401QDA	SN5432J	SNJ5432J	SNJ5432W
Bits	4	4	4	4	4
F @ Nom Voltage(Max), Mhz	100	100	100	100	100
ICC @ Nom Voltage(Max), mA	0.038	0.038	0.038	0.038	0.038
Input Type	TTL	TTL	TTL	TTL	TTL
Operating Temperature Range, C	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125
Output Drive (IOL/IOH)(Max), mA	0.8/-16	0.8/-16	0.8/-16	0.8/-16	0.8/-16
Output Type	TTL	TTL	TTL	TTL	TTL
Package Group	CDIP	CFP	CDIP	CDIP	CFP
Package Size: mm2:W x L, PKG	See datasheet (CDIP)	See datasheet (CFP)	See datasheet (CDIP)	See datasheet (CDIP)	See datasheet (CFP)
Rating	Military	Military	Military	Military	Military
Schmitt Trigger	No	No	No	No	No
Technology Family	TTL	TTL	TTL	TTL	TTL
VCC(Max), V	5.5	5.5	5.5	5.5	5.5
VCC(Min), V	4.5	4.5	4.5	4.5	4.5
tpd @ Nom Voltage(Max), ns	22	22	22	22	22

Öko-Plan

Anwendungshinweise

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  Input and Output Characteristics of Digital Integrated Circuits
  PDF, 1.7 Mb, Datei veröffentlicht: Oct 1, 1996
  This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
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  Live Insertion
  PDF, 150 Kb, Datei veröffentlicht: Oct 1, 1996
  Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
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  Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
  PDF, 614 Kb, Revision: C, Datei veröffentlicht: Dec 2, 2015
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  Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
  PDF, 337 Kb, Datei veröffentlicht: Jul 8, 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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  Designing With Logic (Rev. C)
  PDF, 186 Kb, Revision: C, Datei veröffentlicht: Jun 1, 1997
  Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
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  Introduction to Logic
  PDF, 93 Kb, Datei veröffentlicht: Apr 30, 2015

Modellreihe

Herstellerklassifikation

• Semiconductors> Space & High Reliability> Logic Products> Gate Products