Datasheet Texas Instruments SN54166 — Datenblatt

HerstellerTexas Instruments
SerieSN54166
Datasheet Texas Instruments SN54166

8-Bit-Schieberegister mit parallelem Laden

Datenblätter

Parallel-Load 8-Bit Shift Registers datasheet
PDF, 964 Kb, Datei veröffentlicht: Mar 1, 1988
Auszug aus dem Dokument

Preise

Status

5962-9558301QEA5962-9558301QFASN54166JSNJ54166JSNJ54166W
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNo

Verpackung

5962-9558301QEA5962-9558301QFASN54166JSNJ54166JSNJ54166W
N12345
Pin1616161616
Package TypeJWJJW
Industry STD TermCDIPCFPCDIPCDIPCFP
JEDEC CodeR-GDIP-TR-GDFP-FR-GDIP-TR-GDIP-TR-GDFP-F
Package QTY11111
CarrierTUBETUBETUBETUBETUBE
Device MarkingASNJ54166WSN54166J5962-9558301QESNJ54166W
Width (mm)6.926.736.926.926.73
Length (mm)19.5610.319.5619.5610.3
Thickness (mm)4.571.654.574.571.65
Pitch (mm)2.541.272.542.541.27
Max Height (mm)5.082.035.085.082.03
Mechanical DataHerunterladenHerunterladenHerunterladenHerunterladenHerunterladen

Öko-Plan

5962-9558301QEA5962-9558301QFASN54166JSNJ54166JSNJ54166W
RoHSSee ti.comSee ti.comSee ti.comSee ti.comSee ti.com

Anwendungshinweise

  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, Datei veröffentlicht: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Power-Up Behavior of Clocked Devices (Rev. A)
    PDF, 34 Kb, Revision: A, Datei veröffentlicht: Feb 6, 2015
  • Live Insertion
    PDF, 150 Kb, Datei veröffentlicht: Oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, Datei veröffentlicht: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Datei veröffentlicht: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revision: C, Datei veröffentlicht: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Kb, Datei veröffentlicht: Apr 30, 2015

Modellreihe

Herstellerklassifikation

  • Semiconductors> Space & High Reliability> Logic Products> Flip-Flop/Latch/Registers