Datasheet Texas Instruments PTH08T230W — Datenblatt
Hersteller | Texas Instruments |
Serie | PTH08T230W |
Nicht isoliertes Leistungsmodul mit 6 A, 4,5 V bis 14 V Eingang, nicht isoliert und breitem Ausgang mit TurboTrans
Datenblätter
6-A 4.5V-14V Input Non-Isolated Wide Output Adjustable Power Module w/TurboTrans datasheet
PDF, 1.3 Mb, Revision: L, Datei veröffentlicht: Aug 15, 2011
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Preise
Status
PTH08T230WAD | PTH08T230WAS | PTH08T230WAST | PTH08T230WAZ | PTH08T230WAZT | |
---|---|---|---|---|---|
Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
Manufacture's Sample Availability | No | No | Yes | Yes | Yes |
Verpackung
PTH08T230WAD | PTH08T230WAS | PTH08T230WAST | PTH08T230WAZ | PTH08T230WAZT | |
---|---|---|---|---|---|
N | 1 | 2 | 3 | 4 | 5 |
Pin | 10 | 10 | 10 | 10 | 10 |
Package Type | ECL | ECM | ECM | BCM | BCM |
Industry STD Term | Through-Hole Module | Surface Mount Module | Surface Mount Module | Surface Mount Module | Surface Mount Module |
JEDEC Code | R-PDSS-T | R-PDSS-B | R-PDSS-B | R-PDSS-B | R-PDSS-B |
Package QTY | 36 | 36 | 250 | 36 | 250 |
Carrier | TIW TRAY | TIW TRAY | SMALL T&R | TIW TRAY | SMALL T&R |
Width (mm) | 15.75 | 15.75 | 15.75 | 15.75 | 15.75 |
Length (mm) | 18.92 | 18.92 | 18.92 | 18.92 | 18.92 |
Thickness (mm) | 7.5 | 7.5 | 7.5 | 7.5 | 7.5 |
Pitch (mm) | 2.54 | 2.54 | 2.54 | 2.54 | 2.54 |
Max Height (mm) | 8 | .341 | .341 | 9.09 | 9.09 |
Mechanical Data | Herunterladen | Herunterladen | Herunterladen | Herunterladen | Herunterladen |
Parameter
Parameters / Models | PTH08T230WAD | PTH08T230WAS | PTH08T230WAST | PTH08T230WAZ | PTH08T230WAZT |
---|---|---|---|---|---|
Iout(Max), A | 6 | 6 | 6 | 6 | 6 |
Operating Temperature Range, C | -40 to 85 | -40 to 85 | -40 to 85 | -40 to 85 | -40 to 85 |
Package Size: mm2:W x L, PKG | 10Surface Mount Module: 334 mm2: 16.76 x 19.94(Surface Mount Module),10Through-Hole Module: 334 mm2: 16.76 x 19.94(Through-Hole Module) | 10Surface Mount Module: 334 mm2: 16.76 x 19.94(Surface Mount Module),10Through-Hole Module: 334 mm2: 16.76 x 19.94(Through-Hole Module) | 10Surface Mount Module: 334 mm2: 16.76 x 19.94(Surface Mount Module),10Through-Hole Module: 334 mm2: 16.76 x 19.94(Through-Hole Module) | 10Surface Mount Module: 334 mm2: 16.76 x 19.94(Surface Mount Module),10Through-Hole Module: 334 mm2: 16.76 x 19.94(Through-Hole Module) | 10Surface Mount Module: 334 mm2: 16.76 x 19.94(Surface Mount Module),10Through-Hole Module: 334 mm2: 16.76 x 19.94(Through-Hole Module) |
Package Type | Open-Frame | Open-Frame | Open-Frame | Open-Frame | Open-Frame |
Regulated Outputs | 1 | 1 | 1 | 1 | 1 |
Special Features | TurboTrans | TurboTrans | TurboTrans | TurboTrans | TurboTrans |
Vin(Max), V | 14 | 14 | 14 | 14 | 14 |
Vin(Min), V | 4.5 | 4.5 | 4.5 | 4.5 | 4.5 |
Vout(Max), V | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 |
Vout(Min), V | 0.7 | 0.7 | 0.7 | 0.7 | 0.7 |
Öko-Plan
PTH08T230WAD | PTH08T230WAS | PTH08T230WAST | PTH08T230WAZ | PTH08T230WAZT | |
---|---|---|---|---|---|
RoHS | Not Compliant | Not Compliant | Not Compliant | Not Compliant | Not Compliant |
Anwendungshinweise
- C6474 (x4) Power Using ModulesPDF, 131 Kb, Datei veröffentlicht: Oct 1, 2008
- Power management for processor core voltage requirementsPDF, 186 Kb, Datei veröffentlicht: Dec 14, 2006
- Power Two Xilinx(TM) LX240 Virtex-6(TM) DevicesPDF, 63 Kb, Datei veröffentlicht: Apr 20, 2010
This reference design is intended to help designers wishing to use two of the new Virtex-6™ LX240 FPGA along with DDR memory and other optional circuitry in their designs. It provides nine rails of lower voltage with an input of 12 volts. The use of PTH T2 modules provides a high-performance solution for good transient response and tight regulation while conserving valuable board space. - High-Temperatures Soldering Requirements for Plug-in Power, Surface-Mount Pdts (Rev. A)PDF, 112 Kb, Revision: A, Datei veröffentlicht: Aug 13, 2009
Modellreihe
Serie: PTH08T230W (5)
Herstellerklassifikation
- Semiconductors> Power Management> Power Modules> Non-Isolated Module> Step-Down (Buck) Module