Datasheet Texas Instruments PTH08T220W — Datenblatt

HerstellerTexas Instruments
SeriePTH08T220W

16-A-, 4,5-V- bis 14-V-Eingang, nicht isoliert, Einstellung des breiten Ausgangs, Leistungsmodul mit TurboTrans

Datenblätter

16-A, 4.5-V to 14-V Input, Non-Isolated, Wide Output Adjustable Power Module datasheet
PDF, 1.3 Mb, Revision: K, Datei veröffentlicht: Jun 29, 2009
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Preise

Status

PTH08T220WADPTH08T220WAHPTH08T220WASPTH08T220WASTPTH08T220WAZPTH08T220WAZT
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoYesNoYesYesYes

Verpackung

PTH08T220WADPTH08T220WAHPTH08T220WASPTH08T220WASTPTH08T220WAZPTH08T220WAZT
N123456
Pin111111111111
Package TypeEASEASEATEATBATBAT
Industry STD TermThrough-Hole ModuleThrough-Hole ModuleSurface Mount ModuleSurface Mount ModuleSurface Mount ModuleSurface Mount Module
JEDEC CodeR-PDSS-TR-PDSS-TR-PDSS-BR-PDSS-BR-PDSS-BR-PDSS-B
Package QTY42424225042250
CarrierTIW TRAYTIW TRAYTIW TRAYSMALL T&RTIW TRAYSMALL T&R
Width (mm)18.9318.9318.9318.9318.9318.93
Length (mm)22.122.122.122.122.122.1
Thickness (mm)8.258.258.258.258.258.25
Pitch (mm)2.542.542.542.542.542.54
Max Height (mm)8.58.58.58.58.58.5
Mechanical DataHerunterladenHerunterladenHerunterladenHerunterladenHerunterladenHerunterladen

Parameter

Parameters / ModelsPTH08T220WADPTH08T220WAHPTH08T220WASPTH08T220WASTPTH08T220WAZPTH08T220WAZT
Iout(Max), A161616161616
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85
Package Size: mm2:W x L, PKG11Surface Mount Module: 461 mm2: 19.94 x 23.11(Surface Mount Module),11Surface Mount Module: 461 mm2: 23.11 x 19.94(Surface Mount Module),11Through-Hole Module: 418 mm2: 18.93 x 22.1(Through-Hole Module)11Surface Mount Module: 461 mm2: 19.94 x 23.11(Surface Mount Module),11Surface Mount Module: 461 mm2: 23.11 x 19.94(Surface Mount Module),11Through-Hole Module: 418 mm2: 18.93 x 22.1(Through-Hole Module)11Surface Mount Module: 461 mm2: 19.94 x 23.11(Surface Mount Module),11Surface Mount Module: 461 mm2: 23.11 x 19.94(Surface Mount Module),11Through-Hole Module: 418 mm2: 18.93 x 22.1(Through-Hole Module)11Surface Mount Module: 461 mm2: 19.94 x 23.11(Surface Mount Module),11Surface Mount Module: 461 mm2: 23.11 x 19.94(Surface Mount Module),11Through-Hole Module: 418 mm2: 18.93 x 22.1(Through-Hole Module)11Surface Mount Module: 461 mm2: 19.94 x 23.11(Surface Mount Module),11Surface Mount Module: 461 mm2: 23.11 x 19.94(Surface Mount Module),11Through-Hole Module: 418 mm2: 18.93 x 22.1(Through-Hole Module)11Surface Mount Module: 461 mm2: 19.94 x 23.11(Surface Mount Module),11Surface Mount Module: 461 mm2: 23.11 x 19.94(Surface Mount Module),11Through-Hole Module: 418 mm2: 18.93 x 22.1(Through-Hole Module)
Package TypeOpen-FrameOpen-FrameOpen-FrameOpen-FrameOpen-FrameOpen-Frame
Regulated Outputs111111
Special FeaturesTurboTransTurboTransTurboTransTurboTransTurboTransTurboTrans
Vin(Max), V141414141414
Vin(Min), V4.54.54.54.54.54.5
Vout(Max), V5.55.55.55.55.55.5
Vout(Min), V0.70.70.70.70.70.7

Öko-Plan

PTH08T220WADPTH08T220WAHPTH08T220WASPTH08T220WASTPTH08T220WAZPTH08T220WAZT
RoHSNot CompliantNot CompliantNot CompliantNot CompliantNot CompliantNot Compliant

Anwendungshinweise

  • Power management for processor core voltage requirements
    PDF, 186 Kb, Datei veröffentlicht: Dec 14, 2006
  • Power Two Xilinx(TM) LX240 Virtex-6(TM) Devices
    PDF, 63 Kb, Datei veröffentlicht: Apr 20, 2010
    This reference design is intended to help designers wishing to use two of the new Virtex-6™ LX240 FPGA along with DDR memory and other optional circuitry in their designs. It provides nine rails of lower voltage with an input of 12 volts. The use of PTH T2 modules provides a high-performance solution for good transient response and tight regulation while conserving valuable board space.
  • High-Temperatures Soldering Requirements for Plug-in Power, Surface-Mount Pdts (Rev. A)
    PDF, 112 Kb, Revision: A, Datei veröffentlicht: Aug 13, 2009

Modellreihe

Herstellerklassifikation

  • Semiconductors> Power Management> Power Modules> Non-Isolated Module> Step-Down (Buck) Module