Datasheet Texas Instruments PTH04T261W — Datenblatt

HerstellerTexas Instruments
SeriePTH04T261W

3-A, 2,2 V bis 5,5 V Eingang, Keramikkappenversion, Nicht-ISO, breiter Ausgang, Adj-Leistungsmodul mit TurboTrans

Datenblätter

3-A, 2.2-V to 5.5-V Input, Non-Isolated, Wide-Output, Adjustable Power Module datasheet
PDF, 1.2 Mb, Revision: E, Datei veröffentlicht: Jul 9, 2009
Auszug aus dem Dokument

Preise

Status

PTH04T261WADPTH04T261WASPTH04T261WAZ
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityYesYesYes

Verpackung

PTH04T261WADPTH04T261WASPTH04T261WAZ
N123
Pin101010
Package TypeECLECMBCM
Industry STD TermThrough-Hole ModuleSurface Mount ModuleSurface Mount Module
JEDEC CodeR-PDSS-TR-PDSS-BR-PDSS-B
Package QTY363636
CarrierTIW TRAYTIW TRAYTIW TRAY
Width (mm)15.7515.7515.75
Length (mm)18.9218.9218.92
Thickness (mm)7.57.57.5
Pitch (mm)2.542.542.54
Max Height (mm)8.3419.09
Mechanical DataHerunterladenHerunterladenHerunterladen

Parameter

Parameters / ModelsPTH04T261WADPTH04T261WASPTH04T261WAZ
Iout(Max), A333
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85
Package Size: mm2:W x L, PKG10Surface Mount Module: 334 mm2: 16.76 x 19.94(Surface Mount Module),10Through-Hole Module: 334 mm2: 16.76 x 19.94(Through-Hole Module)10Surface Mount Module: 334 mm2: 16.76 x 19.94(Surface Mount Module),10Through-Hole Module: 334 mm2: 16.76 x 19.94(Through-Hole Module)10Surface Mount Module: 334 mm2: 16.76 x 19.94(Surface Mount Module),10Through-Hole Module: 334 mm2: 16.76 x 19.94(Through-Hole Module)
Package TypeOpen-FrameOpen-FrameOpen-Frame
Regulated Outputs111
Special FeaturesTurboTransTurboTransTurboTrans
Vin(Max), V5.55.55.5
Vin(Min), V2.22.22.2
Vout(Max), V3.63.63.6
Vout(Min), V0.690.690.69

Öko-Plan

PTH04T261WADPTH04T261WASPTH04T261WAZ
RoHSNot CompliantNot CompliantNot Compliant

Anwendungshinweise

  • High-Temperatures Soldering Requirements for Plug-in Power, Surface-Mount Pdts (Rev. A)
    PDF, 112 Kb, Revision: A, Datei veröffentlicht: Aug 13, 2009

Modellreihe

Herstellerklassifikation

  • Semiconductors> Power Management> Power Modules> Non-Isolated Module> Step-Down (Buck) Module