Datasheet Texas Instruments PT3301N — Datenblatt
| Hersteller | Texas Instruments |
| Serie | PT3301 |
| Artikelnummer | PT3301N |
Datenblätter
Preise
Status
| Lifecycle Status | NRND (Not recommended for new designs) |
| Manufacture's Sample Availability | No |
Verpackung
| Pin | 19 |
| Package Type | EHG |
| Industry STD Term | SIP MODULE |
| JEDEC Code | R-MSIP-T |
| Width (mm) | 12.95 |
| Length (mm) | 76.7 |
| Thickness (mm) | 24.13 |
| Pitch (mm) | 2.54 |
| Max Height (mm) | 25.9 |
| Mechanical Data | Herunterladen |
Öko-Plan
| RoHS | Not Compliant |
| Pb Free | No |
Anwendungshinweise
- Reflow Soldering Requirements for Plug-In Power Suface-Mount ProductsPDF, 44 Kb, Datei veröffentlicht: Aug 1, 2000
Describes the soldering requirements for the surface mount versions of all Plug-in Power products, and gives guidelines for the development of a suitable reflow profile. - ISR Input/Output Filters (Rev. A)PDF, 81 Kb, Revision: A, Datei veröffentlicht: Aug 3, 2000
- EMI Considerations for DC to DC Converters and Integrated Switching Regulators (Rev. A)PDF, 38 Kb, Revision: A, Datei veröffentlicht: Aug 3, 2000
- ISR Qualification Process (Rev. A)PDF, 50 Kb, Revision: A, Datei veröffentlicht: Aug 3, 2000
Modellreihe
Herstellerklassifikation
- Semiconductors > Power Management > Power Modules > Non-Isolated Module > Step-Down (Buck) Module