Datasheet Texas Instruments MSP430G2332-EP — Datenblatt
| Hersteller | Texas Instruments |
| Serie | MSP430G2332-EP |
Verbesserter Produkt-Mixed-Signal-Mikrocontroller
Datenblätter
Mixed Signal Microcontroller . datasheet
PDF, 1.1 Mb, Revision: A, Datei veröffentlicht: Oct 31, 2012
Auszug aus dem Dokument
Preise
Status
| MSP430G2332QPW2EP | MSP430G2332QPW2REP | V62/12625-01XE | V62/12625-01XE-T | |
|---|---|---|---|---|
| Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No | No | Yes | Yes |
Verpackung
| MSP430G2332QPW2EP | MSP430G2332QPW2REP | V62/12625-01XE | V62/12625-01XE-T | |
|---|---|---|---|---|
| N | 1 | 2 | 3 | 4 |
| Pin | 20 | 20 | 20 | 20 |
| Package Type | PW | PW | PW | PW |
| Industry STD Term | TSSOP | TSSOP | TSSOP | TSSOP |
| JEDEC Code | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G |
| Package QTY | 70 | 2000 | 2000 | 70 |
| Carrier | TUBE | LARGE T&R | LARGE T&R | TUBE |
| Device Marking | G2332EP | G2332EP | G2332EP | G2332EP |
| Width (mm) | 4.4 | 4.4 | 4.4 | 4.4 |
| Length (mm) | 6.5 | 6.5 | 6.5 | 6.5 |
| Thickness (mm) | 1 | 1 | 1 | 1 |
| Pitch (mm) | .65 | .65 | .65 | .65 |
| Max Height (mm) | 1.2 | 1.2 | 1.2 | 1.2 |
| Mechanical Data | Herunterladen | Herunterladen | Herunterladen | Herunterladen |
Parameter
| Parameters / Models | MSP430G2332QPW2EP | MSP430G2332QPW2REP | V62/12625-01XE | V62/12625-01XE-T |
|---|---|---|---|---|
| ADC | ADC10 - 8ch | ADC10 - 8ch | ADC10 - 8ch | ADC10 - 8ch |
| AES | N/A | N/A | N/A | N/A |
| Active Power, uA/MHz | 220 | 220 | 220 | 220 |
| Additional Features | Watchdog,Temp Sensor,Brown Out Reset | Watchdog,Temp Sensor,Brown Out Reset | Watchdog,Temp Sensor,Brown Out Reset | Watchdog,Temp Sensor,Brown Out Reset |
| BSL | None | None | None | None |
| CPU | MSP430 | MSP430 | MSP430 | MSP430 |
| DMA | 1 | 1 | 1 | 1 |
| Frequency, MHz | 16 | 16 | 16 | 16 |
| GPIO | 16 | 16 | 16 | 16 |
| I2C | 1 | 1 | 1 | 1 |
| Max VCC | 3.6 | 3.6 | 3.6 | 3.6 |
| Min VCC | 1.8 | 1.8 | 1.8 | 1.8 |
| Multiplier | N/A | N/A | N/A | N/A |
| Non-volatile Memory, KB | 4 | 4 | 4 | 4 |
| Operating Temperature Range, C | -40 to 125 | -40 to 125 | -40 to 125 | -40 to 125 |
| Package Group | TSSOP | TSSOP | TSSOP | TSSOP |
| Package Size: mm2:W x L, PKG | 20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP) | 20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP) | 20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP) | 20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP) |
| RAM, KB | 0.25 | 0.25 | 0.25 | 0.25 |
| Rating | HiRel Enhanced Product | HiRel Enhanced Product | HiRel Enhanced Product | HiRel Enhanced Product |
| SPI | 1 | 1 | 1 | 1 |
| Special I/O | N/A | N/A | N/A | N/A |
| Standby Power, LPM3-uA | 0.5 | 0.5 | 0.5 | 0.5 |
| Timers - 16-bit | 1 | 1 | 1 | 1 |
| Wakeup Time, us | 1 | 1 | 1 | 1 |
Öko-Plan
| MSP430G2332QPW2EP | MSP430G2332QPW2REP | V62/12625-01XE | V62/12625-01XE-T | |
|---|---|---|---|---|
| RoHS | Compliant | Compliant | Compliant | Compliant |
Anwendungshinweise
- Migrating From MSP430 F2xx and G2xx Families to MSP430 FR4xx and FR2xx Family (Rev. E)PDF, 237 Kb, Revision: E, Datei veröffentlicht: May 4, 2018
This application report helps to ease the migration from MSP430F2xx flash-based MCUs to the MSP430FR4xx and MSP430FR2xx family of FRAM-based MCUs. It discusses programming system hardware core architecture and peripheral considerations. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR4xx and MSP430FR2xx devices see the MSP430
Modellreihe
Serie: MSP430G2332-EP (4)
Herstellerklassifikation
- Semiconductors> Space & High Reliability> Microcontroller> Low Power MCU> MSP430 MCU