Datasheet Texas Instruments MSP430G2302-EP — Datenblatt
Hersteller | Texas Instruments |
Serie | MSP430G2302-EP |
Verbesserter Produkt-Mixed-Signal-Mikrocontroller
Datenblätter
Mixed Signal Microcontroller, MSP430G2302-EP datasheet
PDF, 1.0 Mb, Revision: A, Datei veröffentlicht: Nov 27, 2012
Auszug aus dem Dokument
Preise
Status
MSP430G2302IPW1EP | MSP430G2302IPW1REP | V62/12623-01XE | V62/12623-01XE-T | |
---|---|---|---|---|
Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
Manufacture's Sample Availability | No | No | No | No |
Verpackung
MSP430G2302IPW1EP | MSP430G2302IPW1REP | V62/12623-01XE | V62/12623-01XE-T | |
---|---|---|---|---|
N | 1 | 2 | 3 | 4 |
Pin | 14 | 14 | 14 | 14 |
Package Type | PW | PW | PW | PW |
Industry STD Term | TSSOP | TSSOP | TSSOP | TSSOP |
JEDEC Code | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G |
Package QTY | 90 | 2000 | 2000 | 90 |
Carrier | TUBE | LARGE T&R | LARGE T&R | TUBE |
Device Marking | G2302EP | G2302EP | G2302EP | G2302EP |
Width (mm) | 4.4 | 4.4 | 4.4 | 4.4 |
Length (mm) | 5 | 5 | 5 | 5 |
Thickness (mm) | 1 | 1 | 1 | 1 |
Pitch (mm) | .65 | .65 | .65 | .65 |
Max Height (mm) | 1.2 | 1.2 | 1.2 | 1.2 |
Mechanical Data | Herunterladen | Herunterladen | Herunterladen | Herunterladen |
Parameter
Parameters / Models | MSP430G2302IPW1EP | MSP430G2302IPW1REP | V62/12623-01XE | V62/12623-01XE-T |
---|---|---|---|---|
ADC | N/A | N/A | N/A | N/A |
AES | N/A | N/A | N/A | N/A |
Active Power, uA/MHz | 220 | 220 | 220 | 220 |
Additional Features | Watchdog,Brown Out Reset | Watchdog,Brown Out Reset | Watchdog,Brown Out Reset | Watchdog,Brown Out Reset |
BSL | None | None | None | None |
CPU | MSP430 | MSP430 | MSP430 | MSP430 |
Frequency, MHz | 16 | 16 | 16 | 16 |
GPIO | 16 | 16 | 16 | 16 |
I2C | 1 | 1 | 1 | 1 |
Max VCC | 3.6 | 3.6 | 3.6 | 3.6 |
Min VCC | 1.8 | 1.8 | 1.8 | 1.8 |
Multiplier | N/A | N/A | N/A | N/A |
Non-volatile Memory, KB | 4 | 4 | 4 | 4 |
Operating Temperature Range, C | -40 to 85 | -40 to 85 | -40 to 85 | -40 to 85 |
Package Group | TSSOP | TSSOP | TSSOP | TSSOP |
Package Size: mm2:W x L, PKG | 14TSSOP: 32 mm2: 6.4 x 5(TSSOP) | 14TSSOP: 32 mm2: 6.4 x 5(TSSOP) | 14TSSOP: 32 mm2: 6.4 x 5(TSSOP) | 14TSSOP: 32 mm2: 6.4 x 5(TSSOP) |
RAM, KB | 0.25 | 0.25 | 0.25 | 0.25 |
Rating | HiRel Enhanced Product | HiRel Enhanced Product | HiRel Enhanced Product | HiRel Enhanced Product |
SPI | 1 | 1 | 1 | 1 |
Special I/O | Capacitive Touch I/O | Capacitive Touch I/O | Capacitive Touch I/O | Capacitive Touch I/O |
Standby Power, LPM3-uA | 0.5 | 0.5 | 0.5 | 0.5 |
Timers - 16-bit | 1 | 1 | 1 | 1 |
Wakeup Time, us | 1 | 1 | 1 | 1 |
Öko-Plan
MSP430G2302IPW1EP | MSP430G2302IPW1REP | V62/12623-01XE | V62/12623-01XE-T | |
---|---|---|---|---|
RoHS | Compliant | Compliant | Compliant | Compliant |
Anwendungshinweise
- Migrating From MSP430 F2xx and G2xx Families to MSP430 FR4xx and FR2xx Family (Rev. E)PDF, 237 Kb, Revision: E, Datei veröffentlicht: May 4, 2018
This application report helps to ease the migration from MSP430F2xx flash-based MCUs to the MSP430FR4xx and MSP430FR2xx family of FRAM-based MCUs. It discusses programming system hardware core architecture and peripheral considerations. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR4xx and MSP430FR2xx devices see the MSP430
Modellreihe
Serie: MSP430G2302-EP (4)
Herstellerklassifikation
- Semiconductors> Space & High Reliability> Microcontroller> Low Power MCU> MSP430 MCU