Datasheet Texas Instruments LMZ31530 — Datenblatt

Hersteller	Texas Instruments
Serie	LMZ31530

Datenblätter

Preise

Status

Verpackung

Parameter

Parameters / Models	LMZ31530RLGT
Iout(Max), A	30
Operating Temperature Range, C	-40 to 85
Package Size: mm2:W x L, PKG	72BQFN: 240 mm2: 15 x 16(BQFN)
Package Type	QFN
Regulated Outputs	1
Soft Start	Adjustable
Special Features	EMI Tested,Enable,Light Load Efficiency,Power Good,Remote Sense
Switching Frequency(Max), kHz	850
Switching Frequency(Min), kHz	300
Switching Frequency(Typ), kHz	500
Vin(Max), V	14.5
Vin(Min), V	3
Vout(Max), V	3.6
Vout(Min), V	0.6

Öko-Plan

Anwendungshinweise

• Herunterladen
  Working With QFN Power Modules (Rev. A)
  PDF, 1.7 Mb, Revision: A, Datei veröffentlicht: Jun 8, 2017
  TexasInstrumentsQuadFlatpackNo-lead(QFN)powermodulesallowfor boardminiaturization,and holdseveraladvantagesoverotherpowermodulepackages.The QFNpackageshavehigherpowerdensity,asmallerroutingarea,improvedthermalperformance,and improvedelectricalparasitics.Additionally,theabsenceof externalleadseliminatesbent-leadconc
• Herunterladen
  Soldering Requirements for BQFN Packages (Rev. B)
  PDF, 737 Kb, Revision: B, Datei veröffentlicht: Jun 8, 2017
  This documentoutlinesthe solderingrequirementsfor the TPS84and LMZ3devicefamilies
• Herunterladen
  Uninterruptible Synchronization Clock Circuit
  PDF, 74 Kb, Datei veröffentlicht: Nov 22, 2013
• Herunterladen
  AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
  PDF, 3.6 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
• Herunterladen
  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Mb, Revision: B, Datei veröffentlicht: Apr 23, 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
• Herunterladen
  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
  PDF, 2.5 Mb, Revision: C, Datei veröffentlicht: Apr 24, 2013
  Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
• Herunterladen
  Semiconductor and IC Package Thermal Metrics (Rev. C)
  PDF, 201 Kb, Revision: C, Datei veröffentlicht: Apr 19, 2016
• Herunterladen
  QFN and SON PCB Attachment (Rev. B)
  PDF, 821 Kb, Revision: B, Datei veröffentlicht: Aug 24, 2018
• Herunterladen
  Input and Output Capacitor Selection
  PDF, 219 Kb, Datei veröffentlicht: Sep 19, 2005

Modellreihe

Herstellerklassifikation

• Semiconductors> Power Management> Power Modules> Non-Isolated Module> Step-Down (Buck) Module