Datasheet Texas Instruments LMR12015 — Datenblatt

Hersteller	Texas Instruments
Serie	LMR12015

Datenblätter

Preise

Status

Verpackung

Parameter

Parameters / Models	LMR12015XSD/NOPB	LMR12015XSDX/NOPB
Control Mode	Current Mode	Current Mode
Duty Cycle(Max), %	90	90
Iout(Max), A	1.5	1.5
Iq(Typ), mA	2.4	2.4
Operating Temperature Range, C	-40 to 125	-40 to 125
Package Group	WSON	WSON
Rating	Catalog	Catalog
Regulated Outputs	1	1
Special Features	Enable,Frequency Synchronization	Enable,Frequency Synchronization
Switching Frequency(Max), kHz	2300	2300
Switching Frequency(Min), kHz	1000	1000
Type	Converter	Converter
Vin(Max), V	20	20
Vin(Min), V	3	3
Vout(Max), V	18	18
Vout(Min), V	1	1

Öko-Plan

Anwendungshinweise

• Herunterladen
  AN-643 EMI/RFI Board Design (Rev. B)
  PDF, 742 Kb, Revision: B, Datei veröffentlicht: May 3, 2004
  Application Note 643 EMI/RFI Board Design
• Herunterladen
  Input and Output Capacitor Selection
  PDF, 219 Kb, Datei veröffentlicht: Sep 19, 2005
• Herunterladen
  AN-1197 Selecting Inductors for Buck Converters (Rev. B)
  PDF, 558 Kb, Revision: B, Datei veröffentlicht: Apr 23, 2013
  This application report provides design information to help select an off-the-shelf inductor for anycontinuous-mode buck converter application.
• Herunterladen
  AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
  PDF, 3.6 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
• Herunterladen
  AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
  PDF, 1.4 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
  This application note provides thermal power analysis techniques for analyzing the power IC.
• Herunterladen
  AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
  PDF, 2.7 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
  This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
• Herunterladen
  Semiconductor and IC Package Thermal Metrics (Rev. C)
  PDF, 201 Kb, Revision: C, Datei veröffentlicht: Apr 19, 2016
• Herunterladen
  AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
  PDF, 82 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
  When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
• Herunterladen
  AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
  PDF, 374 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
  This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
• Herunterladen
  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
  PDF, 2.5 Mb, Revision: C, Datei veröffentlicht: Apr 24, 2013
  Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
• Herunterladen
  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Mb, Revision: B, Datei veröffentlicht: Apr 23, 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

Modellreihe

Herstellerklassifikation

• Semiconductors> Power Management> Non-isolated DC/DC Switching Regulator> Step-Down (Buck)> Buck Converter (Integrated Switch)