Datasheet Texas Instruments LMR10520 — Datenblatt

HerstellerTexas Instruments
SerieLMR10520
Datasheet Texas Instruments LMR10520

SIMPLE SWITCHER 5.5Vin, 2A Abwärtsspannungsregler in SOT-23 und LLP

Datenblätter

SIMPLE SWITCHER 5.5Vin, 2.0A Step-Dwn V-Reg in LLP datasheet
PDF, 1.0 Mb, Revision: B, Datei veröffentlicht: Apr 4, 2013
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Preise

Status

LMR10520XSD/NOPBLMR10520XSDE/NOPBLMR10520XSDX/NOPBLMR10520YSD/NOPBLMR10520YSDE/NOPBLMR10520YSDX/NOPB
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoYesNoYesNo

Verpackung

LMR10520XSD/NOPBLMR10520XSDE/NOPBLMR10520XSDX/NOPBLMR10520YSD/NOPBLMR10520YSDE/NOPBLMR10520YSDX/NOPB
N123456
Pin666666
Package TypeNGGNGGNGGNGGNGGNGG
Industry STD TermWSONWSONWSONWSONWSONWSON
JEDEC CodeS-PDSO-NS-PDSO-NS-PDSO-NS-PDSO-NS-PDSO-NS-PDSO-N
Package QTY1000250450010002504500
CarrierSMALL T&RSMALL T&RLARGE T&RSMALL T&RSMALL T&RLARGE T&R
Device MarkingL266BL266BL266BL267BL267BL267B
Width (mm)333333
Length (mm)333333
Thickness (mm).8.8.8.8.8.8
Pitch (mm).95.95.95.95.95.95
Max Height (mm).8.8.8.8.8.8
Mechanical DataHerunterladenHerunterladenHerunterladenHerunterladenHerunterladenHerunterladen

Parameter

Parameters / ModelsLMR10520XSD/NOPB
LMR10520XSD/NOPB
LMR10520XSDE/NOPB
LMR10520XSDE/NOPB
LMR10520XSDX/NOPB
LMR10520XSDX/NOPB
LMR10520YSD/NOPB
LMR10520YSD/NOPB
LMR10520YSDE/NOPB
LMR10520YSDE/NOPB
LMR10520YSDX/NOPB
LMR10520YSDX/NOPB
Control ModeCurrent ModeCurrent ModeCurrent ModeCurrent ModeCurrent ModeCurrent Mode
Duty Cycle(Max), %949494949494
Iout(Max), A222222
Iq(Typ), mA3.33.33.33.33.33.3
Operating Temperature Range, C-40 to 125-40 to 125-40 to 125-40 to 125-40 to 125-40 to 125
Package GroupWSONWSONWSONWSONWSONWSON
RatingCatalogCatalogCatalogCatalogCatalogCatalog
Regulated Outputs111111
Special FeaturesEnableEnableEnableEnableEnableEnable
Switching Frequency(Max), kHz300030003000300030003000
Switching Frequency(Min), kHz160016001600160016001600
TypeConverterConverterConverterConverterConverterConverter
Vin(Max), V5.55.55.55.55.55.5
Vin(Min), V333333
Vout(Max), V4.54.54.54.54.54.5
Vout(Min), V0.60.60.60.60.60.6

Öko-Plan

LMR10520XSD/NOPBLMR10520XSDE/NOPBLMR10520XSDX/NOPBLMR10520YSD/NOPBLMR10520YSDE/NOPBLMR10520YSDX/NOPB
RoHSCompliantCompliantCompliantCompliantCompliantCompliant

Anwendungshinweise

  • QFN and SON PCB Attachment (Rev. B)
    PDF, 821 Kb, Revision: B, Datei veröffentlicht: Aug 24, 2018
  • AN-643 EMI/RFI Board Design (Rev. B)
    PDF, 742 Kb, Revision: B, Datei veröffentlicht: May 3, 2004
    Application Note 643 EMI/RFI Board Design
  • Input and Output Capacitor Selection
    PDF, 219 Kb, Datei veröffentlicht: Sep 19, 2005
  • AN-1197 Selecting Inductors for Buck Converters (Rev. B)
    PDF, 558 Kb, Revision: B, Datei veröffentlicht: Apr 23, 2013
    This application report provides design information to help select an off-the-shelf inductor for anycontinuous-mode buck converter application.
  • AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
    PDF, 3.6 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
    This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
  • AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
    PDF, 1.4 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
    This application note provides thermal power analysis techniques for analyzing the power IC.
  • AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
    PDF, 2.7 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
    This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
  • Semiconductor and IC Package Thermal Metrics (Rev. C)
    PDF, 201 Kb, Revision: C, Datei veröffentlicht: Apr 19, 2016
  • Absolute Maximum Ratings for Soldering (Rev. D)
    PDF, 52 Kb, Revision: D, Datei veröffentlicht: Jun 9, 2016
  • AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
    PDF, 82 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
    When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
  • AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
    PDF, 374 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
    This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
  • AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
    PDF, 2.5 Mb, Revision: C, Datei veröffentlicht: Apr 24, 2013
    Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
  • AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
    PDF, 9.2 Mb, Revision: B, Datei veröffentlicht: Apr 23, 2013
    This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

Modellreihe

Herstellerklassifikation

  • Semiconductors> Power Management> Non-isolated DC/DC Switching Regulator> Step-Down (Buck)> Buck Converter (Integrated Switch)