Datasheet Texas Instruments LM2736 — Datenblatt
Hersteller | Texas Instruments |
Serie | LM2736 |
Dünner SOT23 750mA Last-Abwärts-DC-DC-Regler
Datenblätter
LM2736 Thin SOT 750 mA Load Step-Down DC-DC Regulator datasheet
PDF, 1.5 Mb, Revision: H, Datei veröffentlicht: Dec 29, 2014
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Status
LM2736XMK | LM2736XMK/NOPB | LM2736XMKX/NOPB | LM2736YMK | LM2736YMK/NOPB | LM2736YMKX/NOPB | |
---|---|---|---|---|---|---|
Lifecycle Status | NRND (Not recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | NRND (Not recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
Manufacture's Sample Availability | No | Yes | No | Yes | Yes | Yes |
Verpackung
LM2736XMK | LM2736XMK/NOPB | LM2736XMKX/NOPB | LM2736YMK | LM2736YMK/NOPB | LM2736YMKX/NOPB | |
---|---|---|---|---|---|---|
N | 1 | 2 | 3 | 4 | 5 | 6 |
Pin | 6 | 6 | 6 | 6 | 6 | 6 |
Package Type | DDC | DDC | DDC | DDC | DDC | DDC |
Industry STD Term | SOT-23-THIN | SOT-23-THIN | SOT-23-THIN | SOT-23-THIN | SOT-23-THIN | SOT-23-THIN |
JEDEC Code | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G |
Package QTY | 1000 | 1000 | 3000 | 1000 | 1000 | 3000 |
Carrier | LARGE T&R | LARGE T&R | LARGE T&R | LARGE T&R | LARGE T&R | LARGE T&R |
Device Marking | SHAB | SHAB | SHAB | SHBB | SHBB | SHBB |
Width (mm) | 1.6 | 1.6 | 1.6 | 1.6 | 1.6 | 1.6 |
Length (mm) | 2.9 | 2.9 | 2.9 | 2.9 | 2.9 | 2.9 |
Thickness (mm) | .87 | .87 | .87 | .87 | .87 | .87 |
Pitch (mm) | .95 | .95 | .95 | .95 | .95 | .95 |
Max Height (mm) | 1.1 | 1.1 | 1.1 | 1.1 | 1.1 | 1.1 |
Mechanical Data | Herunterladen | Herunterladen | Herunterladen | Herunterladen | Herunterladen | Herunterladen |
Parameter
Parameters / Models | LM2736XMK | LM2736XMK/NOPB | LM2736XMKX/NOPB | LM2736YMK | LM2736YMK/NOPB | LM2736YMKX/NOPB |
---|---|---|---|---|---|---|
Control Mode | Current Mode | Current Mode | Current Mode | Current Mode | Current Mode | Current Mode |
Duty Cycle(Max), % | 96 | 96 | 96 | 96 | 96 | 96 |
Iout(Max), A | 0.75 | 0.75 | 0.75 | 0.75 | 0.75 | 0.75 |
Iq(Typ), mA | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 |
Operating Temperature Range, C | -40 to 125 | -40 to 125 | -40 to 125 | -40 to 125 | -40 to 125 | -40 to 125 |
Package Group | SOT-23-THIN | SOT-23-THIN | SOT-23-THIN | SOT-23-THIN | SOT-23-THIN | SOT-23-THIN |
Rating | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog |
Regulated Outputs | 1 | 1 | 1 | 1 | 1 | 1 |
Special Features | Enable,Light Load Efficiency,Pre-Bias Start-Up | Enable,Light Load Efficiency,Pre-Bias Start-Up | Enable,Light Load Efficiency,Pre-Bias Start-Up | Enable,Light Load Efficiency,Pre-Bias Start-Up | Enable,Light Load Efficiency,Pre-Bias Start-Up | Enable,Light Load Efficiency,Pre-Bias Start-Up |
Switching Frequency(Max), kHz | 1900 | 1900 | 1900 | 1900 | 1900 | 1900 |
Switching Frequency(Min), kHz | 400 | 400 | 400 | 400 | 400 | 400 |
Type | Converter | Converter | Converter | Converter | Converter | Converter |
Vin(Max), V | 18 | 18 | 18 | 18 | 18 | 18 |
Vin(Min), V | 3 | 3 | 3 | 3 | 3 | 3 |
Vout(Max), V | 16 | 16 | 16 | 16 | 16 | 16 |
Vout(Min), V | 1.25 | 1.25 | 1.25 | 1.25 | 1.25 | 1.25 |
Öko-Plan
LM2736XMK | LM2736XMK/NOPB | LM2736XMKX/NOPB | LM2736YMK | LM2736YMK/NOPB | LM2736YMKX/NOPB | |
---|---|---|---|---|---|---|
RoHS | See ti.com | Compliant | Compliant | See ti.com | Compliant | Compliant |
Anwendungshinweise
- Power Management Considerations for FPGAs and ASICsPDF, 745 Kb, Datei veröffentlicht: Mar 22, 2007
- AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)PDF, 1.4 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
This application note provides thermal power analysis techniques for analyzing the power IC. - AN-643 EMI/RFI Board Design (Rev. B)PDF, 742 Kb, Revision: B, Datei veröffentlicht: May 3, 2004
Application Note 643 EMI/RFI Board Design - AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)PDF, 82 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current - AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)PDF, 2.7 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time. - AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)PDF, 9.2 Mb, Revision: B, Datei veröffentlicht: Apr 23, 2013
This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP - AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)PDF, 3.6 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor. - AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)PDF, 374 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
This application report provides SIMPLE SWITCHER™ PCB layout guidelines. - AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)PDF, 2.5 Mb, Revision: C, Datei veröffentlicht: Apr 24, 2013
Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti - Semiconductor and IC Package Thermal Metrics (Rev. C)PDF, 201 Kb, Revision: C, Datei veröffentlicht: Apr 19, 2016
- Input and Output Capacitor SelectionPDF, 219 Kb, Datei veröffentlicht: Sep 19, 2005
Modellreihe
Serie: LM2736 (6)
Herstellerklassifikation
- Semiconductors> Power Management> Non-isolated DC/DC Switching Regulator> Step-Down (Buck)> Buck Converter (Integrated Switch)