Datasheet Texas Instruments LM2591HV — Datenblatt

Hersteller	Texas Instruments
Serie	LM2591HV

Datenblätter

Preise

Status

Verpackung

Parameter

Parameters / Models	LM2591HVS-3.3/NOPB	LM2591HVS-5.0	LM2591HVS-5.0/NOPB	LM2591HVS-ADJ	LM2591HVS-ADJ/NOPB	LM2591HVSX-3.3/NOPB	LM2591HVSX-5.0	LM2591HVSX-5.0/NOPB	LM2591HVSX-ADJ	LM2591HVSX-ADJ/NOPB	LM2591HVT-3.3/NOPB	LM2591HVT-5.0	LM2591HVT-5.0/NOPB	LM2591HVT-ADJ/NOPB
Approx. Price (US$)							2.00 | 1ku		2.00 | 1ku
Control Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode
Duty Cycle(Max), %	100	100	100	100	100	100		100		100	100	100	100	100
Duty Cycle(Max)(%)							100		100
Iout(Max), A	1	1	1	1	1	1		1		1	1	1	1	1
Iout(Max)(A)							1		1
Iq(Typ), mA	1	1	1	1	1	1		1		1	1	1	1	1
Iq(Typ)(mA)							1		1
Operating Temperature Range, C	-40 to 125	-40 to 125	-40 to 125	-40 to 125	-40 to 125	-40 to 125		-40 to 125		-40 to 125	-40 to 125	-40 to 125	-40 to 125	-40 to 125
Operating Temperature Range(C)							-40 to 125		-40 to 125
Package Group	DDPAK/TO-263	DDPAK/TO-263	DDPAK/TO-263	DDPAK/TO-263	DDPAK/TO-263	DDPAK/TO-263	DDPAK/TO-263	DDPAK/TO-263	DDPAK/TO-263	DDPAK/TO-263	TO-220	TO-220	TO-220	TO-220
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
Regulated Outputs	1	1	1	1	1	1		1		1	1	1	1	1
Regulated Outputs(#)							1		1
Special Features	Enable	Enable	Enable	Enable	Enable	Enable	Enable	Enable	Enable	Enable	Enable	Enable	Enable	Enable
Switching Frequency(Max), kHz	173	173	173	173	173	173		173		173	173	173	173	173
Switching Frequency(Max)(kHz)							173		173
Switching Frequency(Min), kHz	110	110	110	110	110	110		110		110	110	110	110	110
Switching Frequency(Min)(kHz)							110		110
Type	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter
Vin(Max), V	60	60	60	60	60	60		60		60	60	60	60	60
Vin(Max)(V)							60		60
Vin(Min), V	4.5	4.5	4.5	4.5	4.5	4.5		4.5		4.5	4.5	4.5	4.5	4.5
Vin(Min)(V)							4.5		4.5
Vout(Max), V	57	57	57	57	57	57		57		57	57	57	57	57
Vout(Max)(V)							57		57
Vout(Min), V	3.3	3.3	3.3	3.3	3.3	3.3		3.3		3.3	3.3	3.3	3.3	3.3
Vout(Min)(V)							3.3		3.3

Öko-Plan

Anwendungshinweise

• Herunterladen
  AN-643 EMI/RFI Board Design (Rev. B)
  PDF, 742 Kb, Revision: B, Datei veröffentlicht: May 3, 2004
  Application Note 643 EMI/RFI Board Design
• Herunterladen
  Cost-Effective Transformerless Offline Supply for Light Load Applications (Rev. A)
  PDF, 295 Kb, Revision: A, Datei veröffentlicht: Jun 16, 2015
  This design idea provides a simple non-isolated AC/DC power supply for low power applications. Thedesign uses a "capacitive-dropper" front-end combined with a LM46000 SIMPLE SWITCHERВ® buckregulator from Texas Instruments. The circuit provides 3.3 V at a minimum of 100 mA from a line supply of90 VAC to 265 VAC. Theory of operation as well as design equations and performance results are given.
• Herunterladen
  Input and Output Capacitor Selection
  PDF, 219 Kb, Datei veröffentlicht: Sep 19, 2005
• Herunterladen
  AN-1197 Selecting Inductors for Buck Converters (Rev. B)
  PDF, 558 Kb, Revision: B, Datei veröffentlicht: Apr 23, 2013
  This application report provides design information to help select an off-the-shelf inductor for anycontinuous-mode buck converter application.
• Herunterladen
  AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
  PDF, 3.6 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
• Herunterladen
  AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
  PDF, 1.4 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
  This application note provides thermal power analysis techniques for analyzing the power IC.
• Herunterladen
  AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
  PDF, 2.7 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
  This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
• Herunterladen
  Semiconductor and IC Package Thermal Metrics (Rev. C)
  PDF, 201 Kb, Revision: C, Datei veröffentlicht: Apr 19, 2016
• Herunterladen
  Cap Drop Offline Supply for E-Meters
  PDF, 291 Kb, Datei veröffentlicht: Jun 16, 2015
  This design idea provides a simple non-isolated AC/DC power supply for low power applications such assmart grid E-meter applications. The design uses a "capacitive-dropper" front-end combined with aLM46000 SIMPLE SWITCHERВ® buck regulator from Texas Instruments. The circuit provides 3.3 V at aminimum of 50 mA from a line supply of 90 VAC to 265 VAC. Theory of operation as well as designequa
• Herunterladen
  Low EMI Layout Made SIMPLE With LM43600/1/2/3 and LM46000/1/2 (Rev. A)
  PDF, 512 Kb, Revision: A, Datei veröffentlicht: Sep 12, 2014
  Printed Circuit Board (PCB) layout for Switched Mode Power Supplies (SMPS) is critical to achieve proper converter operation good thermal performance and excellent radiated EMI performance. Optimized board layout for low radiated EMI is made very simple by the package and pin arrangement of the SIMPLE SWITCHER Synchronous Buck Converter family LM4360x and LM4600x
• Herunterladen
  Simple Techniques Minimize Cross-Coupling in Distributed Power Systems
  PDF, 335 Kb, Datei veröffentlicht: Mar 21, 2007
• Herunterladen
  AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
  PDF, 82 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
  When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
• Herunterladen
  AN-1081 Low-Cost Low-Parts-Count DC/DC Converter With Multiple Outputs (Rev. B)
  PDF, 124 Kb, Revision: B, Datei veröffentlicht: Apr 23, 2013
  This application report describes a simple low cost, low parts-count multiple output DC/DC converterbased on the LM2596 five terminal step-down switching regulator. The circuit described provides multipleoutput voltages (positive and negative) with good regulation using a step-down converter circuit withflyback windings. It uses only one switching regulator IC.
• Herunterladen
  AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
  PDF, 374 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
  This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
• Herunterladen
  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
  PDF, 2.5 Mb, Revision: C, Datei veröffentlicht: Apr 24, 2013
  Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
• Herunterladen
  AN-1246 Stresses in Wide Input DC-DC Converters (Rev. C)
  PDF, 427 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
  This application note discusses stresses in wide input DC-DC converters.
• Herunterladen
  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Mb, Revision: B, Datei veröffentlicht: Apr 23, 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

Modellreihe

Herstellerklassifikation

• Semiconductors> Power Management> Non-isolated DC/DC Switching Regulator> Step-Down (Buck)> Buck Converter (Integrated Switch)