Datasheet Texas Instruments LM2574 — Datenblatt

Hersteller	Texas Instruments
Serie	LM2574

Datenblätter

Preise

Status

Verpackung

Parameter

Parameters / Models	LM2574M-12	LM2574M-12/NOPB	LM2574M-3.3/NOPB	LM2574M-5.0	LM2574M-5.0/NOPB	LM2574M-ADJ	LM2574M-ADJ/NOPB	LM2574MX-12/NOPB	LM2574MX-3.3/NOPB	LM2574MX-5.0	LM2574MX-5.0/NOPB	LM2574MX-ADJ	LM2574MX-ADJ/NOPB	LM2574N-12/NOPB	LM2574N-3.3/NOPB	LM2574N-5.0/NOPB	LM2574N-ADJ/NOPB
Approx. Price (US$)	1.04 | 1ku											1.04 | 1ku
Control Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode	Voltage Mode
Duty Cycle(Max), %		98	98	98	98	98	98	98	98	98	98		98	98	98	98	98
Duty Cycle(Max)(%)	98											98
Iout(Max), A		0.5	0.5	0.5	0.5	0.5	0.5	0.5	0.5	0.5	0.5		0.5	0.5	0.5	0.5	0.5
Iout(Max)(A)	0.5											0.5
Iq(Typ), mA		5	5	5	5	5	5	5	5	5	5		5	5	5	5	5
Iq(Typ)(mA)	5											5
Operating Temperature Range, C		-40 to 125	-40 to 125	-40 to 125	-40 to 125	-40 to 125	-40 to 125	-40 to 125	-40 to 125	-40 to 125	-40 to 125		-40 to 125	-40 to 125	-40 to 125	-40 to 125	-40 to 125
Operating Temperature Range(C)	-40 to 125											-40 to 125
Package Group	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	PDIP	PDIP	PDIP	PDIP
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
Regulated Outputs		1	1	1	1	1	1	1	1	1	1		1	1	1	1	1
Regulated Outputs(#)	1											1
Special Features	Enable	Enable	Enable	Enable	Enable	Enable	Enable	Enable	Enable	Enable	Enable	Enable	Enable	Enable	Enable	Enable	Enable
Switching Frequency(Max), kHz		52	52	52	52	52	52	52	52	52	52		52	52	52	52	52
Switching Frequency(Max)(kHz)	52											52
Switching Frequency(Min), kHz		52	52	52	52	52	52	52	52	52	52		52	52	52	52	52
Switching Frequency(Min)(kHz)	52											52
Type	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter	Converter
Vin(Max), V		40	40	40	40	40	40	40	40	40	40		40	40	40	40	40
Vin(Max)(V)	40											40
Vin(Min), V		4	4	4	4	4	4	4	4	4	4		4	4	4	4	4
Vin(Min)(V)	4											4
Vout(Max), V		37	37	37	37	37	37	37	37	37	37		37	37	37	37	37
Vout(Max)(V)	37											37
Vout(Min), V		3.3	3.3	3.3	3.3	3.3	3.3	3.3	3.3	3.3	3.3		3.3	3.3	3.3	3.3	3.3
Vout(Min)(V)	3.3											3.3

Öko-Plan

Anwendungshinweise

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  This application report provides design information to help select an off-the-shelf inductor for anycontinuous-mode buck converter application.
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  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
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  This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
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  Printed Circuit Board (PCB) layout for Switched Mode Power Supplies (SMPS) is critical to achieve proper converter operation good thermal performance and excellent radiated EMI performance. Optimized board layout for low radiated EMI is made very simple by the package and pin arrangement of the SIMPLE SWITCHER Synchronous Buck Converter family LM4360x and LM4600x
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  AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
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  When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
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  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
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Modellreihe

Herstellerklassifikation

• Semiconductors> Power Management> Non-isolated DC/DC Switching Regulator> Step-Down (Buck)> Buck Converter (Integrated Switch)