Datasheet Texas Instruments ISO7831 — Datenblatt
Hersteller | Texas Instruments |
Serie | ISO7831 |
Hochimmunitätsverstärkter 5,7 kVRMS-verstärkter digitaler Dreikanal-2/1-Isolator, 100 Mbit / s
Datenblätter
ISO7831x High-Performance, 8000-VPK Reinforced Triple Digital Isolators datasheet
PDF, 1.4 Mb, Revision: B, Datei veröffentlicht: Jun 28, 2016
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Status
ISO7831DW | ISO7831DWR | ISO7831DWW | ISO7831DWWR | ISO7831FDW | ISO7831FDWR | ISO7831FDWW | ISO7831FDWWR | |
---|---|---|---|---|---|---|---|---|
Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
Manufacture's Sample Availability | Yes | No | Yes | No | Yes | Yes | No | No |
Verpackung
ISO7831DW | ISO7831DWR | ISO7831DWW | ISO7831DWWR | ISO7831FDW | ISO7831FDWR | ISO7831FDWW | ISO7831FDWWR | |
---|---|---|---|---|---|---|---|---|
N | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 |
Pin | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Package Type | DW | DW | DWW | DWW | DW | DW | DWW | DWW |
Industry STD Term | SOIC | SOIC | SOIC | SOIC | ||||
JEDEC Code | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | ||||
Package QTY | 40 | 2000 | 45 | 1000 | 40 | 2000 | 45 | 1000 |
Carrier | TUBE | LARGE T&R | TUBE | LARGE T&R | TUBE | LARGE T&R | TUBE | LARGE T&R |
Device Marking | ISO7831 | ISO7831 | ISO7831 | ISO7831 | ISO7831F | ISO7831F | ISO7831F | ISO7831F |
Width (mm) | 7.5 | 7.5 | 14 | 14 | 7.5 | 7.5 | 14 | 14 |
Length (mm) | 10.3 | 10.3 | 10.3 | 10.3 | 10.3 | 10.3 | 10.3 | 10.3 |
Thickness (mm) | 2.35 | 2.35 | 2.45 | 2.45 | 2.35 | 2.35 | 2.45 | 2.45 |
Pitch (mm) | 1.27 | 1.27 | 1.27 | 1.27 | ||||
Max Height (mm) | 2.65 | 2.65 | 2.65 | 2.65 | ||||
Mechanical Data | Herunterladen | Herunterladen | Herunterladen | Herunterladen | Herunterladen | Herunterladen | Herunterladen | Herunterladen |
Parameter
Parameters / Models | ISO7831DW | ISO7831DWR | ISO7831DWW | ISO7831DWWR | ISO7831FDW | ISO7831FDWR | ISO7831FDWW | ISO7831FDWWR |
---|---|---|---|---|---|---|---|---|
Data Rate(Max), Mbps | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
Default Output | High | High | High | High | Low | Low | Low | Low |
Forward/Reverse Channels | 2/1 | 2/1 | 2/1 | 2/1 | 2/1 | 2/1 | 2/1 | 2/1 |
Integrated Isolated Power | No | No | No | No | No | No | No | No |
Isolation Rating, Vrms | 5700 | 5700 | 5700 | 5700 | 5700 | 5700 | 5700 | 5700 |
Number of Channels | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
Operating Temperature Range, C | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 |
Package Group | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
Package Size: mm2:W x L, PKG | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) |
Propagation Delay, ns | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 |
Propagation Delay(Typ), ns | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 |
Rating | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog |
Surge Voltage Rating, Vpk | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
VCC(Max), V | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 |
VCC(Min), V | 2.25 | 2.25 | 2.25 | 2.25 | 2.25 | 2.25 | 2.25 | 2.25 |
Öko-Plan
ISO7831DW | ISO7831DWR | ISO7831DWW | ISO7831DWWR | ISO7831FDW | ISO7831FDWR | ISO7831FDWW | ISO7831FDWWR | |
---|---|---|---|---|---|---|---|---|
RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Anwendungshinweise
- Pushing the envelope with high-performance digital-isolation technologyPDF, 147 Kb, Datei veröffentlicht: Oct 30, 2015
- 4Q 2015 Analog Applications JournalPDF, 1.6 Mb, Datei veröffentlicht: Oct 30, 2015
- Shelf-Life Evaluation of Lead-Free Component FinishesPDF, 1.3 Mb, Datei veröffentlicht: May 24, 2004
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a - Isolation GlossaryPDF, 52 Kb, Datei veröffentlicht: Oct 27, 2014
- Digital Isolator Design Guide (Rev. A)PDF, 487 Kb, Revision: A, Datei veröffentlicht: Nov 4, 2014
Modellreihe
Serie: ISO7831 (8)
Herstellerklassifikation
- Semiconductors> Isolation> Digital Isolators