Datasheet Texas Instruments ISO7330-Q1 — Datenblatt

Hersteller	Texas Instruments
Serie	ISO7330-Q1

Automotive, Low Power, Dreikanal-3/0-Digitalisolator

Datenblätter

PDF, 1.3 Mb, Datei veröffentlicht: Nov 16, 2015

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	ISO7330CQDWQ1	ISO7330CQDWRQ1	ISO7330FCQDWQ1	ISO7330FCQDWRQ1
Lifecycle Status	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)
Manufacture's Sample Availability	Yes	Yes	No	No

	ISO7330CQDWQ1	ISO7330CQDWRQ1	ISO7330FCQDWQ1	ISO7330FCQDWRQ1
N	1	2	3	4
Pin	16	16	16	16
Package Type	DW	DW	DW	DW
Industry STD Term	SOIC	SOIC	SOIC	SOIC
JEDEC Code	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G
Package QTY	40	2000	40	2000
Carrier	TUBE	LARGE T&R	TUBE	LARGE T&R
Device Marking	ISO7330CQ	ISO7330CQ	ISO7330FCQ	ISO7330FCQ
Width (mm)	7.5	7.5	7.5	7.5
Length (mm)	10.3	10.3	10.3	10.3
Thickness (mm)	2.35	2.35	2.35	2.35
Pitch (mm)	1.27	1.27	1.27	1.27
Max Height (mm)	2.65	2.65	2.65	2.65
Mechanical Data	Herunterladen	Herunterladen	Herunterladen	Herunterladen

Parameters / Models	ISO7330CQDWQ1	ISO7330CQDWRQ1	ISO7330FCQDWQ1	ISO7330FCQDWRQ1
Data Rate(Max), Mbps	25	25	25	25
Default Output	High	High	Low	Low
Forward/Reverse Channels	3/0	3/0	3/0	3/0
Integrated Isolated Power	No	No	No	No
Isolation Rating, Vrms	3000	3000	3000	3000
Number of Channels	3	3	3	3
Operating Temperature Range, C	-40 to 125	-40 to 125	-40 to 125	-40 to 125
Package Group	SOIC	SOIC	SOIC	SOIC
Package Size: mm2:W x L, PKG	16SOIC: 106 mm2: 10.3 x 10.3(SOIC)	16SOIC: 106 mm2: 10.3 x 10.3(SOIC)	16SOIC: 106 mm2: 10.3 x 10.3(SOIC)	16SOIC: 106 mm2: 10.3 x 10.3(SOIC)
Propagation Delay, ns	31	31	31	31
Propagation Delay(Typ), ns	31	31	31	31
Rating	Automotive	Automotive	Automotive	Automotive
Surge Voltage Rating, Vpk	6000	6000	6000	6000
VCC(Max), V	5	5	5	5
VCC(Min), V	3.3	3.3	3.3	3.3

	ISO7330CQDWQ1	ISO7330CQDWRQ1	ISO7330FCQDWQ1	ISO7330FCQDWRQ1
RoHS	Compliant	Compliant	Compliant	Compliant

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Shelf-Life Evaluation of Lead-Free Component Finishes
PDF, 1.3 Mb, Datei veröffentlicht: May 24, 2004
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a

Serie: ISO7330-Q1 (4)