Datasheet Texas Instruments ISO5851DWR — Datenblatt
| Hersteller | Texas Instruments |
| Serie | ISO5851 |
| Artikelnummer | ISO5851DWR |
Verstärkter isolierter IGBT-Gate-Treiber mit hoher CMTI- und Miller-Klemme 16-SOIC -40 bis 125
Datenblätter
ISO5851 High-CMTI 2.5-A and 5-A Isolated IGBT, MOSFET Gate Driver With Active Protection Features datasheet
PDF, 1.5 Mb, Revision: B, Datei veröffentlicht: Jan 16, 2017
Auszug aus dem Dokument
Preise
Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
Verpackung
| Pin | 16 |
| Package Type | DW |
| Industry STD Term | SOIC |
| JEDEC Code | R-PDSO-G |
| Package QTY | 2000 |
| Carrier | LARGE T&R |
| Device Marking | ISO5851 |
| Width (mm) | 7.5 |
| Length (mm) | 10.3 |
| Thickness (mm) | 2.35 |
| Pitch (mm) | 1.27 |
| Max Height (mm) | 2.65 |
| Mechanical Data | Herunterladen |
Parameter
| DIN V VDE V 0884-10 Working Voltage | 2121 Vpk |
| DIN V VDE V 0884-10 Transient Overvoltage Rating | 8000 Vpk |
| Enable/Disable Function | N/A |
| Input VCC(Max) | 5.5 V |
| Input VCC(Min) | 3 V |
| Isolation Rating | 5700 Vrms |
| Number of Channels | 1 |
| Operating Temperature Range | -40 to 125 C |
| Output VCC/VDD(Max) | 30 V |
| Output VCC/VDD(Min) | 15 V |
| Package Group | SOIC |
| Package Size: mm2:W x L | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) PKG |
| Peak Output Current | 5 A |
| Power Switch | IGBT,SiCFET |
| Prop Delay | 76 ns |
| Prop Delay(Max) | 110 ns |
Öko-Plan
| RoHS | Compliant |
Design Kits und Evaluierungsmodule
- Evaluation Modules & Boards: ISO5851EVM
ISO5851 Evaluation Module (EVM)
Lifecycle Status: Active (Recommended for new designs)
Anwendungshinweise
- Common-mode transient immunity for isolated gate driversPDF, 152 Kb, Datei veröffentlicht: Oct 30, 2015
- Pushing the envelope with high-performance digital-isolation technologyPDF, 147 Kb, Datei veröffentlicht: Oct 30, 2015
- Shelf-Life Evaluation of Lead-Free Component FinishesPDF, 1.3 Mb, Datei veröffentlicht: May 24, 2004
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a - 4Q 2015 Analog Applications JournalPDF, 1.6 Mb, Datei veröffentlicht: Oct 30, 2015
- Isolation GlossaryPDF, 52 Kb, Datei veröffentlicht: Oct 27, 2014
- Digital Isolator Design Guide (Rev. A)PDF, 487 Kb, Revision: A, Datei veröffentlicht: Nov 4, 2014
Modellreihe
Herstellerklassifikation
- Semiconductors > Isolation > Isolated Gate Driver