Datasheet Texas Instruments DM3730 — Datenblatt
Hersteller | Texas Instruments |
Serie | DM3730 |
Prozessor für digitale Medien
Datenblätter
DM3730, DM3725 Digital Media Processors datasheet
PDF, 3.3 Mb, Revision: D, Datei veröffentlicht: Apr 11, 2011
Auszug aus dem Dokument
Preise
Status
DM3730CBC | DM3730CBC100 | DM3730CBCA | DM3730CBCD100 | DM3730CBP | DM3730CBP100 | DM3730CBPA | DM3730CBPD100 | DM3730CUS | DM3730CUS100 | DM3730CUS100NEP | DM3730CUSA | DM3730CUSD100 | VCBU3730GSCUS100 | XDM3730CBP | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Obsolete (Manufacturer has discontinued the production of the device) |
Manufacture's Sample Availability | Yes | Yes | Yes | Yes | No | Yes | Yes | Yes | Yes | Yes | Yes | Yes | No | Yes | Yes |
Verpackung
DM3730CBC | DM3730CBC100 | DM3730CBCA | DM3730CBCD100 | DM3730CBP | DM3730CBP100 | DM3730CBPA | DM3730CBPD100 | DM3730CUS | DM3730CUS100 | DM3730CUS100NEP | DM3730CUSA | DM3730CUSD100 | VCBU3730GSCUS100 | XDM3730CBP | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
N | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |
Pin | 515 | 515 | 515 | 515 | 515 | 515 | 515 | 515 | 423 | 423 | 423 | 423 | 423 | 423 | 515 |
Package Type | CBC | CBC | CBC | CBC | CBP | CBP | CBP | CBP | CUS | CUS | CUS | CUS | CUS | CUS | CBP |
Industry STD Term | POP-FCBGA | POP-FCBGA | POP-FCBGA | POP-FCBGA | POP-FCBGA | POP-FCBGA | POP-FCBGA | POP-FCBGA | FC/CSP | FC/CSP | FC/CSP | FC/CSP | FC/CSP | FC/CSP | POP-FCBGA |
JEDEC Code | S-PBGA-N | S-PBGA-N | S-PBGA-N | S-PBGA-N | S-PBGA-N | S-PBGA-N | S-PBGA-N | S-PBGA-N | S-PBGA-N | S-PBGA-N | S-PBGA-N | S-PBGA-N | S-PBGA-N | S-PBGA-N | S-PBGA-N |
Package QTY | 119 | 119 | 119 | 119 | 168 | 168 | 168 | 168 | 90 | 90 | 90 | 90 | 90 | 90 | |
Device Marking | DM3730CBC | DM3730CBC100 | DM3730CBCA | DM3730CBCD100 | DM3730CBP-AS3 | DM3730CBP100 | DM3730CBPA | DM3730CBPD100-AS3 | DM3730CUS | DM3730CUS100 | DM3730CUS100 | DM3730CUSA | DM3730CUSD100 | DM3730CUS100 | |
Width (mm) | 14 | 14 | 14 | 14 | 12 | 12 | 12 | 12 | 16 | 16 | 16 | 16 | 16 | 16 | 12 |
Length (mm) | 14 | 14 | 14 | 14 | 12 | 12 | 12 | 12 | 16 | 16 | 16 | 16 | 16 | 16 | 12 |
Thickness (mm) | .63 | .63 | .63 | .63 | .5 | .5 | .5 | .5 | .96 | .96 | .96 | .96 | .96 | .96 | .5 |
Pitch (mm) | .5 | .5 | .5 | .5 | .4 | .4 | .4 | .4 | .65 | .65 | .65 | .65 | .65 | .65 | .4 |
Max Height (mm) | .95 | .95 | .95 | .95 | .7 | .7 | .7 | .7 | 1.4 | 1.4 | 1.4 | 1.4 | 1.4 | 1.4 | .7 |
Mechanical Data | Herunterladen | Herunterladen | Herunterladen | Herunterladen | Herunterladen | Herunterladen | Herunterladen | Herunterladen | Herunterladen | Herunterladen | Herunterladen | Herunterladen | Herunterladen | Herunterladen | Herunterladen |
Carrier | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) |
Parameter
Parameters / Models | DM3730CBC | DM3730CBC100 | DM3730CBCA | DM3730CBCD100 | DM3730CBP | DM3730CBP100 | DM3730CBPA | DM3730CBPD100 | DM3730CUS | DM3730CUS100 | DM3730CUS100NEP | DM3730CUSA | DM3730CUSD100 | VCBU3730GSCUS100 | XDM3730CBP |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ARM CPU | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 |
ARM MHz, Max. | 800,1000 | 800,1000 | 800,1000 | 800,1000 | 800,1000 | 800,1000 | 800,1000 | 800,1000 | 800,1000 | 800,1000 | 800,1000 | 800,1000 | 800,1000 | 800,1000 | |
ARM MHz (Max.) | 800 1000 | ||||||||||||||
Applications | Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security | Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security | Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security | Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security | Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security | Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security | Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security | Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security | Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security | Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security | Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security | Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security | Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security | Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security | Audio Automotive Communications and Telecom Computers and Peripherals Consumer Electronics Energy Industrial Medical Security |
Approx. Price (US$) | 25.60 | 1ku | ||||||||||||||
DRAM | LPDDR | LPDDR | LPDDR | LPDDR | LPDDR | LPDDR | LPDDR | LPDDR | LPDDR | LPDDR | LPDDR | LPDDR | LPDDR | LPDDR | LPDDR |
DSP | 1 C64x | 1 C64x | 1 C64x | 1 C64x | 1 C64x | 1 C64x | 1 C64x | 1 C64x | 1 C64x | 1 C64x | 1 C64x | 1 C64x | 1 C64x | 1 C64x | 1 C64x |
DSP MHz, Max. | 660,800 | 660,800 | 660,800 | 660,800 | 660,800 | 660,800 | 660,800 | 660,800 | 660,800 | 660,800 | 660,800 | 660,800 | 660,800 | 660,800 | |
DSP MHz (Max.) | 660 800 | ||||||||||||||
I2C | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
On-Chip L2 Cache | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) |
Operating Systems | Android,DSP/BIOS,Neutrino,ntegrity,Windows Embedded CE,Linux,VXWorks | Android,DSP/BIOS,Neutrino,ntegrity,Windows Embedded CE,Linux,VXWorks | Android,DSP/BIOS,Neutrino,ntegrity,Windows Embedded CE,Linux,VXWorks | Android,DSP/BIOS,Neutrino,ntegrity,Windows Embedded CE,Linux,VXWorks | Android,DSP/BIOS,Neutrino,ntegrity,Windows Embedded CE,Linux,VXWorks | Android,DSP/BIOS,Neutrino,ntegrity,Windows Embedded CE,Linux,VXWorks | Android,DSP/BIOS,Neutrino,ntegrity,Windows Embedded CE,Linux,VXWorks | Android,DSP/BIOS,Neutrino,ntegrity,Windows Embedded CE,Linux,VXWorks | Android,DSP/BIOS,Neutrino,ntegrity,Windows Embedded CE,Linux,VXWorks | Android,DSP/BIOS,Neutrino,ntegrity,Windows Embedded CE,Linux,VXWorks | Android,DSP/BIOS,Neutrino,ntegrity,Windows Embedded CE,Linux,VXWorks | Android,DSP/BIOS,Neutrino,ntegrity,Windows Embedded CE,Linux,VXWorks | Android,DSP/BIOS,Neutrino,ntegrity,Windows Embedded CE,Linux,VXWorks | Android,DSP/BIOS,Neutrino,ntegrity,Windows Embedded CE,Linux,VXWorks | Android DSP/BIOS Neutrino ntegrity Windows Embedded CE Linux VXWorks |
Operating Temperature Range, C | -40 to 105,-40 to 90,0 to 90 | -40 to 105,-40 to 90,0 to 90 | -40 to 105,-40 to 90,0 to 90 | -40 to 105,-40 to 90,0 to 90 | -40 to 105,-40 to 90,0 to 90 | -40 to 105,-40 to 90,0 to 90 | -40 to 105,-40 to 90,0 to 90 | -40 to 105,-40 to 90,0 to 90 | -40 to 105,-40 to 90,0 to 90 | -40 to 105,-40 to 90,0 to 90 | -40 to 105,-40 to 90,0 to 90 | -40 to 105,-40 to 90,0 to 90 | -40 to 105,-40 to 90,0 to 90 | -40 to 105,-40 to 90,0 to 90 | |
Operating Temperature Range(C) | -40 to 105 -40 to 90 0 to 90 | ||||||||||||||
Pin/Package | 423FCBGA, 515POP-FCBGA | 423FCBGA, 515POP-FCBGA | 423FCBGA, 515POP-FCBGA | 423FCBGA, 515POP-FCBGA | 423FCBGA, 515POP-FCBGA | 423FCBGA, 515POP-FCBGA | 423FCBGA, 515POP-FCBGA | 423FCBGA, 515POP-FCBGA | 423FCBGA, 515POP-FCBGA | 423FCBGA, 515POP-FCBGA | 423FCBGA, 515POP-FCBGA | 423FCBGA, 515POP-FCBGA | 423FCBGA, 515POP-FCBGA | 423FCBGA, 515POP-FCBGA | 423FCBGA 515POP-FCBGA |
Rating | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog |
SPI | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
UART, SCI | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | |
UART(SCI) | 4 | ||||||||||||||
USB | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
Video Port, Configurable | 1 Dedicated Input,1 Dedicated Output | 1 Dedicated Input,1 Dedicated Output | 1 Dedicated Input,1 Dedicated Output | 1 Dedicated Input,1 Dedicated Output | 1 Dedicated Input,1 Dedicated Output | 1 Dedicated Input,1 Dedicated Output | 1 Dedicated Input,1 Dedicated Output | 1 Dedicated Input,1 Dedicated Output | 1 Dedicated Input,1 Dedicated Output | 1 Dedicated Input,1 Dedicated Output | 1 Dedicated Input,1 Dedicated Output | 1 Dedicated Input,1 Dedicated Output | 1 Dedicated Input,1 Dedicated Output | 1 Dedicated Input,1 Dedicated Output | |
Video Port (Configurable) | 1 Dedicated Input 1 Dedicated Output | ||||||||||||||
Video Resolution/Frame Rate | D1 or Less,720p | D1 or Less,720p | D1 or Less,720p | D1 or Less,720p | D1 or Less,720p | D1 or Less,720p | D1 or Less,720p | D1 or Less,720p | D1 or Less,720p | D1 or Less,720p | D1 or Less,720p | D1 or Less,720p | D1 or Less,720p | D1 or Less,720p | D1 or Less 720p |
Öko-Plan
DM3730CBC | DM3730CBC100 | DM3730CBCA | DM3730CBCD100 | DM3730CBP | DM3730CBP100 | DM3730CBPA | DM3730CBPD100 | DM3730CUS | DM3730CUS100 | DM3730CUS100NEP | DM3730CUSA | DM3730CUSD100 | VCBU3730GSCUS100 | XDM3730CBP | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Not Compliant |
Pb Free | No |
Anwendungshinweise
- TI OMAP4430 POP SMT Design Guideline (Rev. C)PDF, 3.2 Mb, Revision: C, Datei veröffentlicht: Nov 3, 2011
- AM3715 GPMCPDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:href=http://processors.wiki.ti.com/index.php/Am3715_gpmcThe GPMC is a 16-bit external memory controller. The GPMC data access engine provides a flexible programming model for communicatio - PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUsPDF, 739 Kb, Datei veröffentlicht: Jun 15, 2011
The purpose of a power distribution network (PDN) is to provide clean and reliable power to active devices in the system. The printed circuit board (PCB) is a critical component of the system-level PDN. Therefore, the PCB design is of utmost importance for high-performance low-power microprocessors. This application report provides design requirements and details a step-by-step methodology on how - AM3715/03 Memory SubsystemPDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM3715/03_Memory_SubsystemThe Memory Subsystem in the AM3715/03 devices consists of the internal SRAM and two dedicated memory contr - AM37x/DM37x Schematic ChecklistPDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x/DM37x_Schematic_Checklist.This article provides many tips related to reset, JTAG, peripherals, etc. It should be used as - AM37x EVM Software Developer's GuidePDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_EVM_Software_Developer%27s_Guide.This wiki article illustrates the various software components provided with the A - AM/DM37x Power Estimation SpreadsheetPDF, 20 Kb, Datei veröffentlicht: Jun 7, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or tocontribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Power_Estimation_SpreadsheetThis article discusses the power consumption of the Texas Instruments AM/DM37x high - AM/DM37x OverviewPDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Overview.This document provides an overview of the AM37x applications processor.All trademarks are property of their respective - Ethernet Connectivity via GPMCPDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Ethernet_Connectivity_via_GPMCThe purpose of this article is to describe a solution for connecting Ethernet to various devices, - Setting up AM37x SDRC RegistersPDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Setting_up_AM37x_SDRC_registersThis wiki article describes how to set the SDRC registers in the OMAP35x SDRC module depending o - AM37x CUS Routing GuidelinesPDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_CUS_Routing_Guidelines.CUS package is designed with a new technology called Via Channelв„ў array. This technology allows for e - AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)PDF, 2.2 Mb, Revision: A, Datei veröffentlicht: May 1, 2004
Application Note 1281 Bumped Die (Flip Chip) Packages - PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages Part II (Rev. A)PDF, 2.4 Mb, Revision: A, Datei veröffentlicht: Nov 1, 2013
Once the bottom circuit board has been designed the assembly guidelines for package-on-package (PoP) versions of the OMAP35xx processor and the memory device must be considered.PoP packages have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of final assembly: the circuit board design the solder paste char
- PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages Part I (Rev. B)PDF, 6.7 Mb, Revision: B, Datei veröffentlicht: Jun 13, 2009
Ball grid array (BGA) packages having 0.4mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies; the standard rules of thumb don't apply anymore. In fact the design guidelines for 0.4mm and 0.5mm differ primarily due to issues surrounding shorts or opens between balls under the processor.In addition to the de - 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)PDF, 40.5 Mb, Revision: A, Datei veröffentlicht: Aug 9, 2015
- PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors Part IIPDF, 1.2 Mb, Datei veröffentlicht: Jun 23, 2010
Once the main printed circuit board (PCB) has been designed the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP applications processors have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of PCB assembly: PoP applications process - PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors Part IPDF, 2.0 Mb, Datei veröffentlicht: Jun 23, 2010
Ball grid array (BGA) packages having 0.5mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies. PCBs with package-on-package (PoP) technology have additional assembly requirements and options that need to be considered when designing the PCB.Fine-pitch PCB design is a team effort and may require more than
- Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Mb, Revision: B, Datei veröffentlicht: Aug 13, 2015
- Introduction to TMS320C6000 DSP OptimizationPDF, 535 Kb, Datei veröffentlicht: Oct 6, 2011
The TMS320C6000™ Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications. However to fully leverage the architectural features that C6000™ processors offer code optimization may be required. First this document reviews five key concepts in understanding the C6000 DSP architecture and optimization. Then
Modellreihe
Serie: DM3730 (15)
Herstellerklassifikation
- Semiconductors> Processors> Digital Signal Processors> Media Processors > DaVinci Video Processors