Datasheet Texas Instruments CY54FCT374T — Datenblatt

HerstellerTexas Instruments
SerieCY54FCT374T
Datasheet Texas Instruments CY54FCT374T

Oktale D-Typ-Register mit 3-Zustands-Ausgängen

Datenblätter

8-Bit Registers With 3-State Outputs datasheet
PDF, 692 Kb, Revision: A, Datei veröffentlicht: Oct 1, 2001
Auszug aus dem Dokument

Preise

Status

5962-9221802M2A5962-9221802MRA5962-9221804M2A5962-9221804MRA5962-9221806M2ACY54FCT374ATDMBCY54FCT374ATLMBCY54FCT374CTLMBCY54FCT374TDMBCY54FCT374TLMB
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNoNoNoNoNoNo

Verpackung

5962-9221802M2A5962-9221802MRA5962-9221804M2A5962-9221804MRA5962-9221806M2ACY54FCT374ATDMBCY54FCT374ATLMBCY54FCT374CTLMBCY54FCT374TDMBCY54FCT374TLMB
N12345678910
Pin20202020202020202020
Package TypeFKJFKJFKJFKFKJFK
Industry STD TermLCCCCDIPLCCCCDIPLCCCCDIPLCCCLCCCCDIPLCCC
JEDEC CodeS-CQCC-NR-GDIP-TS-CQCC-NR-GDIP-TS-CQCC-NR-GDIP-TS-CQCC-NS-CQCC-NR-GDIP-TS-CQCC-N
Package QTY1111111111
CarrierTUBETUBETUBETUBETUBETUBETUBETUBETUBETUBE
Width (mm)8.896.928.896.928.896.928.898.896.928.89
Length (mm)8.8924.28.8924.28.8924.28.898.8924.28.89
Thickness (mm)1.834.571.834.571.834.571.831.834.571.83
Pitch (mm)1.272.541.272.541.272.541.271.272.541.27
Max Height (mm)2.035.082.035.082.035.082.032.035.082.03
Mechanical DataHerunterladenHerunterladenHerunterladenHerunterladenHerunterladenHerunterladenHerunterladenHerunterladenHerunterladenHerunterladen
Device MarkingCY54FCT374ATDM9221804M2A374CTLMBA374TLMB

Parameter

Parameters / Models5962-9221802M2A
5962-9221802M2A
5962-9221802MRA
5962-9221802MRA
5962-9221804M2A
5962-9221804M2A
5962-9221804MRA5962-9221806M2ACY54FCT374ATDMBCY54FCT374ATLMB
CY54FCT374ATLMB
CY54FCT374CTLMBCY54FCT374TDMB
CY54FCT374TDMB
CY54FCT374TLMB
CY54FCT374TLMB
3-State OutputYesYesYesYesYesYes
Bits888888
F @ Nom Voltage(Max), Mhz707070707070
ICC @ Nom Voltage(Max), mA0.20.20.20.20.20.2
Input TypeTTLTTLTTLTTLTTLTTL
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125
Output Drive (IOL/IOH)(Max), mA64/-3264/-3264/-3264/-3264/-3264/-32
Output TypeCMOSCMOSCMOSCMOSCMOSCMOS
Package GroupLCCCCDIPLCCCLCCCCDIPLCCC
Package Size: mm2:W x L, PKG20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)
RatingMilitaryMilitaryMilitaryMilitaryMilitaryMilitary
Technology FamilyFCTFCTFCTFCTFCTFCT
VCC(Max), V5.255.255.255.255.255.25
VCC(Min), V4.754.754.754.754.754.75
tpd @ Nom Voltage(Max), ns111111111111

Öko-Plan

5962-9221802M2A5962-9221802MRA5962-9221804M2A5962-9221804MRA5962-9221806M2ACY54FCT374ATDMBCY54FCT374ATLMBCY54FCT374CTLMBCY54FCT374TDMBCY54FCT374TLMB
RoHSSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.com

Anwendungshinweise

  • Power-Up Behavior of Clocked Devices (Rev. A)
    PDF, 34 Kb, Revision: A, Datei veröffentlicht: Feb 6, 2015
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, Datei veröffentlicht: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Datei veröffentlicht: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Kb, Revision: A, Datei veröffentlicht: Jun 22, 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
  • Introduction to Logic
    PDF, 93 Kb, Datei veröffentlicht: Apr 30, 2015

Modellreihe

Herstellerklassifikation

  • Semiconductors> Space & High Reliability> Logic Products> Flip-Flop/Latch/Registers