Datasheet Texas Instruments CY29FCT818T — Datenblatt

HerstellerTexas Instruments
SerieCY29FCT818T

Diagnose-Scan-Register

Datenblätter

Diagnostic Scan Register With 3-State Outputs datasheet
PDF, 527 Kb, Revision: B, Datei veröffentlicht: Nov 2, 2001
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Preise

Status

CY29FCT818CTSOCT
Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

Verpackung

CY29FCT818CTSOCT
N1
Pin24
Package TypeDW
Industry STD TermSOIC
JEDEC CodeR-PDSO-G
Package QTY2000
CarrierLARGE T&R
Device Marking29FCT818C
Width (mm)7.5
Length (mm)15.4
Thickness (mm)2.35
Pitch (mm)1.27
Max Height (mm)2.65
Mechanical DataHerunterladen

Öko-Plan

CY29FCT818CTSOCT
RoHSCompliant

Anwendungshinweise

  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, Datei veröffentlicht: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Datei veröffentlicht: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Kb, Revision: A, Datei veröffentlicht: Jun 22, 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati

Modellreihe

Serie: CY29FCT818T (1)

Herstellerklassifikation

  • Semiconductors> Space & High Reliability> Logic Products> Flip-Flop/Latch/Registers